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Soft circuit substrate for bearing chip and manufacturing method of substrate

A technology for circuit substrates and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., and can solve problems such as short circuits in adjacent circuits, solder resist ink and tin-plating cavities, and circuit breakage.

Pending Publication Date: 2020-11-13
CHIPBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The existing flexible substrate circuit is prone to the following problems. One is the formation of whiskers on the surface of the tin plating layer, which leads to short circuits between adjacent lines;

Method used

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  • Soft circuit substrate for bearing chip and manufacturing method of substrate
  • Soft circuit substrate for bearing chip and manufacturing method of substrate
  • Soft circuit substrate for bearing chip and manufacturing method of substrate

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no. 2 example

[0057] The present invention also has a second embodiment, which differs from the first embodiment in that step (a) also includes the step of "roughening the conductive copper layer before tin plating" so that the conductive copper layer has a roughened copper surface, and all the other steps are Same as the first embodiment. Roughening the conductive copper layer can be accomplished using any suitable method. For example, after the conductive copper layer 110 is patterned to form the wiring pattern P, the conductive copper layer (wiring pattern P) is treated with a chemical solution. In this embodiment, the chemical solution can be, for example, potassium persulfate (K 2 S 2 o 8 ) solution, the suitable concentration is 30-40g / L, sulfuric acid or hydrochloric acid solution, the suitable concentration is 20-30g / L. The conductive copper layer (wiring pattern P) may be soaked in the chemical solution for 10-30 seconds at room temperature. The longer the contact time with th...

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Abstract

The invention provides a soft circuit substrate for bearing a chip and a manufacturing method of the substrate. The manufacturing method sequentially comprises the following steps of: (a) providing aconductive copper layer with a wiring pattern on an insulating base material; (b) forming a first solder mask layer to partially cover the wiring pattern; (c) forming a first tin layer on the conductive copper layer by taking the first solder mask layer as a shield; (d) forming a second tin layer on the first tin layer by taking the first solder mask layer as a shield; and (e) forming a second solder mask layer partially covering the second tin layer and at least partially covering the first solder mask layer.

Description

technical field [0001] The invention relates to a flexible circuit substrate, in particular to a flexible circuit substrate capable of carrying semiconductor chips. Background technique [0002] Most of the flexible circuit substrates used for carrying chips are rolling thin films. In the industry, the combination of flexible circuit substrate and chip has various names according to different assembly modes, such as TCP (Tape Carrier Package) or COF (Chip On Film). Both TCP and COF use a soft circuit substrate as the carrier of the packaged chip. The gold bump (Gold Bμmp) on the chip and the inner lead (Inner Lead) of the copper wiring pattern on the flexible substrate circuit are bonded by thermocompression. ) engagement. [0003] In order to connect the flexible substrate circuit with the gold bump of the chip, there must be a gold-tin eutectic, in which the gold is provided by the gold bump of the chip, and the tin is supplied by the tin formed on the surface of the inn...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/485
CPCH01L21/4846H01L23/485
Inventor 魏兆璟庞规浩
Owner CHIPBOND TECH
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