LED CSP multi-color packaging production process

A production process and color technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of unfavorable market competitiveness, low production efficiency, long-term phosphor layer, etc., achieve short curing time, improve work efficiency, and strong The effect of market competitiveness

Pending Publication Date: 2020-11-17
东莞市三创智能卡技术有限公司
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  • Application Information

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Problems solved by technology

That is, the LED chip in the prior art needs to take a long time to make the phosphor layer, re

Method used

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Example Embodiment

[0016] The present invention will be further described below in conjunction with specific embodiments.

[0017] The present invention provides the first LED CSP multi-color packaging production process, which is characterized in that it includes the following steps:

[0018] The first step: prepare a large area chip;

[0019] Step 2: Mix the phosphor and UV glue to make a phosphor glue, where the phosphor is any one of red light, green light, blue light, ice blue, and pink purple;

[0020] The third step: Distribute the phosphor compound evenly on the wafer, and then bake and cure it by a UV curing machine. The curing time is 1-5 minutes to form a fluorescent layer on the wafer to produce CSP wafers with multiple colors and different color temperatures ;

[0021] Step 4: Cutting the CSP wafers to form multiple independent small CSP wafers of equal area;

[0022] Step 5: Perform spot testing on small CSP chips and sort out qualified small CSP chips;

[0023] Step 6: Package small CSP chip...

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Abstract

The invention discloses an LED CSP multicolor packaging production process. The LED CSP multicolor packaging production process comprises the following steps: 1, preparing a large-area wafer; 2, mixing fluorescent powder and UV glue to prepare a fluorescent powder glue material, wherein the fluorescent powder is any one color of red light, green light, blue light, ice blue and pink purple; 3, uniformly distributing the fluorescent powder sizing material on the wafer, and performing baking and curing for 15 minutes by using a UV curing machine to form a fluorescent layer on the wafer so as to prepare CSP wafers with different colors and different color temperatures; 4, cutting the CSP wafer to form a plurality of independent small CSP wafers with equal areas; 5, performing point measurementon the small CSP wafers, and screening out the qualified small CSP wafers; 6, packaging the small CSP wafers with different colors and different color temperatures on the strip, and rolling the smallCSP wafers into a roll material. The UV glue is used as a glue material, the curing time is extremely short and is only 1-5min, and the working efficiency of the UV glue curing device can be improved.

Description

Technical field: [0001] The invention relates to the technical field of LEDs, in particular to a production process for LED CSP multi-color packaging. Background technique: [0002] In the prior art, when the phosphor layer is made for the LED chip, the phosphor compound formed by mixing silica gel, diluent and phosphor is uniformly covered on the chip, and the chip is baked in an oven at a temperature of 150 degrees for a time of 2 to 4 hours. That is, it takes a long time to manufacture the phosphor layer of the LED chip in the prior art, which leads to low production efficiency and is not conducive to improving market competitiveness. [0003] In view of this, the inventor proposes the following technical solutions. Invention content: [0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a LED CSP multi-color packaging production process. [0005] In order to solve the above-mentioned technical problems, the presen...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/48H01L33/56
CPCH01L33/48H01L33/50H01L33/56H01L2933/0033H01L2933/0041H01L2933/005
Inventor 刘瑛王维志徐渊
Owner 东莞市三创智能卡技术有限公司
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