LED CSP multi-color packaging production process

Abstract

The invention discloses an LED CSP multicolor packaging production process. The LED CSP multicolor packaging production process comprises the following steps: 1, preparing a large-area wafer; 2, mixing fluorescent powder and UV glue to prepare a fluorescent powder glue material, wherein the fluorescent powder is any one color of red light, green light, blue light, ice blue and pink purple; 3, uniformly distributing the fluorescent powder sizing material on the wafer, and performing baking and curing for 15 minutes by using a UV curing machine to form a fluorescent layer on the wafer so as to prepare CSP wafers with different colors and different color temperatures; 4, cutting the CSP wafer to form a plurality of independent small CSP wafers with equal areas; 5, performing point measurementon the small CSP wafers, and screening out the qualified small CSP wafers; 6, packaging the small CSP wafers with different colors and different color temperatures on the strip, and rolling the smallCSP wafers into a roll material. The UV glue is used as a glue material, the curing time is extremely short and is only 1-5min, and the working efficiency of the UV glue curing device can be improved.

Description

Technical field: [0001] The invention relates to the technical field of LEDs, in particular to a production process for LED CSP multi-color packaging. Background technique: [0002] In the prior art, when the phosphor layer is made for the LED chip, the phosphor compound formed by mixing silica gel, diluent and phosphor is uniformly covered on the chip, and the chip is baked in an oven at a temperature of 150 degrees for a time of 2 to 4 hours. That is, it takes a long time to manufacture the phosphor layer of the LED chip in the prior art, which leads to low production efficiency and is not conducive to improving market competitiveness. [0003] In view of this, the inventor proposes the following technical solutions. Invention content: [0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a LED CSP multi-color packaging production process. [0005] In order to solve the above-mentioned technical problems, the presen...

AI Technical Summary

Problems solved by technology

That is, the LED chip in the prior art needs to take a long time to make the phosphor layer, resulting in low production efficiency, which is not conducive to improving market competitiveness