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A ceramic substrate conductive layer spraying equipment

A technology for ceramic substrates and spraying equipment, which is applied to coatings, spray booths, spraying devices, etc., can solve the problems of discontinuous spraying process, reduced production efficiency, and inability to spray ceramic substrates, and achieves continuous process procedures and high production efficiency. Effect

Active Publication Date: 2022-04-01
DONGGUAN UGREN AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Existing spraying a layer of conductive layer on the outer surface of the ceramic substrate requires multiple spraying equipment to complete, the whole spraying process is discontinuous, there is a long time interval between spraying and transfer process, which reduces the production efficiency, and the position of the through hole of the ceramic substrate cannot be to spray

Method used

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  • A ceramic substrate conductive layer spraying equipment
  • A ceramic substrate conductive layer spraying equipment
  • A ceramic substrate conductive layer spraying equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0037] The embodiment of the present invention provides a conductive layer spraying equipment for ceramic substrates. The conductive layer spraying equipment for ceramic substrates integrates multiple functional mechanisms to fully coat the through holes, the upper surface and the four sides of the ceramic substrate. For the structure of the ceramic substrate, please refer to figure 1 , figure 2 As shown, "+" and "-" in the figure are the through holes 1 of the ceramic substrate, and "." are the blind holes 2 of the ceramic substrate. It should be noted here that the shapes of the through hole 1 and the blind hole 2 in the figure are only for example, and are not limited thereto.

[0038] see image 3 , the ceramic substrate conductive layer spraying equipment consists of five parts, from input to output, a through-hole coating mechanism 3, a turning mechanism 4, a surface and side surface spraying mechanism 5, a swing output mechanism 6, and an oven 7. For each part effec...

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Abstract

The invention discloses a ceramic substrate conductive layer spraying equipment, which is used for coating a layer of conductive layer on the through hole, upper surface and four sides of the ceramic substrate. The ceramic substrate conductive layer spraying equipment is sequentially coated by the through hole from input to output The through-hole coating mechanism is used to coat the through-holes of the ceramic substrate, and after the coating is completed, it is transferred to the surface-side spraying mechanism; the surface-side spraying mechanism is used to coat the ceramic substrate. The upper surface and four sides of the substrate are coated, and the coating is output after the coating is completed. The conductive layer spraying equipment of the ceramic substrate provided by the present invention can fully coat the through hole, the upper surface and the four sides of the ceramic substrate through the through-hole coating mechanism and the surface side spraying mechanism. The whole process is continuous and the production efficient.

Description

technical field [0001] The invention relates to the technical field of ceramic substrate production equipment, in particular to a ceramic substrate conductive layer spraying equipment. Background technique [0002] The ceramic substrate can have various forms of lead conductors. For lead conductors, for example, an internal conductive film extending along the interface between predetermined ceramic layers or a through-hole conductor penetrating through predetermined ceramic layers can be formed inside the ceramic substrate, or a conductor extending along the outer surface of the ceramic substrate can also be formed. outer conductive film. Ceramic substrates can be used for mounting semiconductor chip components or other chip components thereon, and for interconnection between these electronic components. Lead conductors can be used to form the electrical pathways that interconnect these components. Ceramic substrates can also be used, for example, in LCR hybrid high-frequ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B13/02B05B16/20B05D3/02B05C5/00B05C11/10B05C11/06B05B12/32B05B15/50B05B15/55
CPCB05B13/0221B05B13/0228B05B16/20B05D3/0254B05C5/00B05C11/1039B05C11/06B05B12/32B05B15/50B05B15/55
Inventor 陈吉昌黄庭君
Owner DONGGUAN UGREN AUTOMATION EQUIP