The invention relates to technical field of PCBs and particularly relates to a production method of a local-thick copper PCB. The production method comprises the following steps of A, drilling, namely drilling on a circuit board; B, primary copper plating; C, secondary copper plating, namely pasting a primary dry film, exposing, developing, and then, carrying out secondary copper plating treatment on the circuit board; D, local thick copper plating, namely pasting a secondary dry film, exposing, developing, and then, carrying out thick copper plating treatment on the circuit board; E, secondary dry film deplating; F, tin plating; and G, primary dry film deplating, etching and tin deplating treatment. According to the production method, secondary copper plating is carried out through covering a region to be etched by using the primary dry film, and then, the region except for the regions where thick copper is needed to be plated are covered by the secondary dry film, so that the process is continuous, local thick copper plating can be realized favorably through only selecting the dry films with proper thicknesses and controlling proper film deplating parameters, and the process flow is simplified; the films can be pasted on a plane every time, so that the films are firmly pasted, the rate of good products is increased, and the quality of the local-thick copper PCB is improved.