A nano-wafer punching method without loss inductance
A nanocrystalline and inductance-consuming technology, which is applied to circuits, electrical components, and fine working devices, can solve problems such as high defect rate, high cost, and reduce nanocrystalline inductance, so as to avoid magnetic fragmentation and excessive tension , cost reduction effect
Active Publication Date: 2022-03-29
SUZHOU ANJIE TECH
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Problems solved by technology
During the cutting process of the round knife, the final shaft will press the nanocrystals to cause secondary magnetic fragmentation, which reduces the inductance of the nanocrystals, and adopts the bending feeding method, which has a high defect rate and high cost
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[0030] The embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
[0031] Such as figure 2 As shown, a nano-wafer knife stamping method without loss inductance is stamped by a nano-wafer knife stamping device. The nano-wafer knife stamping device includes fourteen finale shafts arranged in parallel along the feeding direction, including The first finale, the second finale, the third finale, the fourth finale, the fifth finale, the sixth finale, the seventh finale, the eighth finale, the ninth finale, the tenth finale, the eleventh finale, the twelfth finale and The thirteenth finale, the bottom shaft of the fourth finale and the upper shaft of the seventh finale lower the shaft surface, and are not in contact with other shaft surfaces and strips;
[0032] The feeding m...
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Abstract
The invention discloses a nano-wafer knife stamping method without loss inductance. The stamping is carried out by a nano-wafer knife stamping device. The nano-wafer knife stamping device includes fourteen finale shafts arranged in parallel along the feeding direction. The bottom of the fourth finale shaft is The shaft and the seventh final shaft lower the shaft surface, and are not in contact with other shaft surfaces and material belts; the feeding method of nanocrystals is straight from the beginning of feeding, and there is no bending. The nano-wafer punching method without loss inductance provided by the present invention replaces the conventional pressing shaft with a descending shaft that does not contact the material tape, reduces the pressure caused by the pressing shaft on the nano-crystals, avoids magnetic fragmentation, and keeps the nano-crystal feeding in a straight line. Feeding, the bottom shaft stacks the knives, effectively avoiding the broken magnets caused by angle bending and pulling the material, the feeding is more stable, and the appearance of bad appearance is reduced, and the tension between the pressing shafts is reduced throughout the nanocrystalline feeding process to avoid excessive tension A total of 14 axes can be used to meet the process requirements due to broken magnetism. Compared with the conventional 16 axes, 2 axes are used less and the cost is reduced.
Description
technical field [0001] The invention belongs to the technical field of die-cutting, and in particular relates to a method for punching a nano wafer with a lossless inductance. Background technique [0002] Die-cutting products have developed rapidly in the field of automobile manufacturing and electronics industry. With the rapid development of economy and society, the die-cutting method has gradually expanded from the traditional die-cutting of printed matter to the production of auxiliary materials for electronic products, such as through die-cutting. Cutting process to prepare adhesive products and film products for electronic product bonding, insulating materials, dustproof, shockproof, insulation and shielding. Such as figure 1 As shown, when the existing stamping process stamps nanocrystals, 16 cutter shafts are needed, and the specific steps are as follows: [0003] The first axis L36Y23L8-004E blanks, the second axis stamps the A knife in the non-adhesive area and ...
Claims
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IPC IPC(8): H01L21/304B28D5/00B28D7/04
CPCB28D5/00B28D5/0064B28D5/0082H01L21/304
Inventor 王春生庞从武
Owner SUZHOU ANJIE TECH