Chuck device and semiconductor equipment

Abstract

The invention provides a chuck device and semiconductor equipment. The chuck device comprises a pedestal, a base and a chuck used for bearing a processed workpiece which are sequentially arranged frombottom to top, and a heat insulation piece is arranged between the pedestal and the base; a short circuit structure is further included; the short circuit structure is arranged on the outer sides ofthe base and the pedestal or between the base and the pedestal, and is electrically contacted with the base and the pedestal respectively; and the lower surface of the chuck is attached to the upper surface of the base. According to the invention, a radio frequency power supply can be added, and the process stability is ensured while the radio frequency function is realized.

Description

technical field [0001] The present invention relates to the technical field of microelectronics, and in particular, to a chuck device and a semiconductor device. Background technique [0002] With the development of IC (Integrated circuit, integrated circuit) technology, integrated circuits with smaller process processes have become the development direction of IC technology in today's society, and IC integrated circuit processing equipment with smaller process processes has higher and higher technical requirements. As a key technology affecting the development of IC technology: physical vapor deposition technology, in order to achieve a smaller process, the requirements for the process environment and process conditions are getting higher and higher. In order to achieve a small process and high uniformity coating, magnetron Coating technology combining sputtering and radio frequency sputtering. This coating technology is also increasingly demanding on high-temperature stai...

AI Technical Summary

Problems solved by technology

However, the traditional grounding setting of the heater cannot satisfy the floating charging of the silicon wafer, and cannot add RF power; furthermore, the electrostatic chuck carrying the processed workpiece in the prior art can generally be loaded with DC power and also has a heating function, but It cannot add RF power. Once RF power is added, it may cause ignition and affect process stability.

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