Chip packaging module and electronic equipment

Abstract

The invention discloses a chip packaging module and electronic equipment. The chip packaging module disclosed by the invention comprises a bearing plate (100), a crystal grain (200), an electroconductive adhesive (300), a reinforced connecting part (400) and a packaging layer (500), wherein the crystal grain (200) is electrically connected with the bearing plate (100) through the electroconductiveadhesive (300); the reinforced connecting part (400) is connected with the bearing plate (100); at least part of the reinforced connecting part (400) is arranged in the electroconductive adhesive (300), the packaging layer (500) is arranged on the bearing plate (100), and the packaging layer (500) covers the crystal grain (200), the electroconductive adhesive (300) and the reinforced connecting part (400). According to the scheme, the problem that when reflow soldering is carried out on a circuit board device of the electronic equipment, the internal structure of the chip packaging module isprone to layering due to different degrees of thermal expansion and cold contraction can be solved.

Description

technical field [0001] The present application relates to the technical field of chip packaging, in particular to a chip packaging module and electronic equipment. Background technique [0002] With the rapid development of electronic equipment, the application of electronic equipment is becoming more and more extensive. Electronic equipment such as mobile phones and tablet computers play more and more roles in people's work, life, and entertainment. At the same time, with the improvement of user needs, circuit board devices are the basis of electronic equipment. In order to ensure the stability and reliability of electronic equipment during production and use, the packaging technology of circuit board devices is particularly important. [0003] In the prior art, when the circuit board device performs reflow soldering (reflow soldering, rising from 25°C to the peak temperature of 260°C) process in the intelligent terminal equipment, due to the thermal expansion of the conduc...

AI Technical Summary

Problems solved by technology

[0004] The present application discloses a chip packaging module and electronic equipment, which can solve the problem that delamination easily occurs between the conductive adhesive and the carrier board during reflow soldering of the circuit board device of the current electronic equipment.

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