Double-station six-shaft power module glue pouring device used by pouring and sealing and shuttling of dispensing head in common

Abstract

The invention provides a double-station six-shaft power module glue pouring device used by pouring and sealing and shuttling of a dispensing head in common. A six-guide-rail module (34) is installed on a six-shaft working platform (3) in a three-dimensional parallel and double-station intersecting manner. The six-guide-rail module (34) comprises a guide rail a (3401), a guide rail b (3402), a guide rail c (3403), a guide rail d (3404), a guide rail e (3405), a guide rail f (3406), a pouring sealant head (31), a dry glue dispensing head (32), and two workpiece moving platforms (3), wherein thepouring sealant head (31) and the dry glue dispensing head (32) are installed on the six-guide-rail module (34) in a sliding manner and independently installed on two parallel guide rails in a striding manner, and the two workpiece moving platforms (3) are arranged on the two parallel guide rails in a sliding manner. Pouring and sealing operation and dispensing operation are achieved on one equipment, while control over the glue output amount is combined, the pouring sealant head and the dispensing head are controlled to shuttle and work in a forked manner between the parallel A / B stations, precise connection of working procedures and precise control over the glue amount are achieved, the dispensing speed can be increased, the dispensing effect of dripping needed glue quantitatively in a timing manner can be improved, the problems of blocking, glue drying, glue leaking and the like are eliminated completely, and the power module assembling efficiency and product quality are improved.

Description

technical field [0001] The invention relates to the structural improvement technology of the automatic potting and dispensing platform device of circuit board module packaging, which belongs to the device for pouring liquid or other fluid substances into the surface of the workpiece according to IPC classification B05C5 / 00, especially the shuttle sharing of potting and dispensing heads Double-station six-axis power module glue filling device. Background technique [0002] Packaging is the process of assembling integrated circuits into chip final products. Simply put, it is to put the bare integrated circuits produced by the foundry on a substrate that acts as a load-bearing function, lead out the pins, and then fix and package them into a overall. Packaging represents the process and action of placement, fixing, sealing, and wiring; at the same time, the form and type of packaging need to pay attention to the material of the substrate, shell, and wiring, emphasizing the imp...

AI Technical Summary

Problems solved by technology

Since the power module circuit board needs to go through multiple processes such as placing the substrate, pouring the primer, dispensing the quick-drying glue, adding the cover, pressing the potting glue, and removing the module, etc., the glue head and the quick-drying glue are now potted. The dispensing head needs to be reciprocated between two independent potting and sealing machines and quick-drying dispensing machines according to the double-station cross-reciprocating operation. The traditional process mostly uses manual potting and quick-drying dispensing, which is time-consuming and labor-intensive, and the labor intensity is high. The efficiency is low, the amount of glue is not easy to control, and the excess thermal conductive glue flowing out of the nozzle needs to be manually wiped off, which greatly reduces the assembly efficiency and quality of the power module

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