Analog-to-digital conversion device and method with substrate temperature compensation for infrared focal plane

A technology of infrared focal plane and substrate temperature, applied in the field of infrared focal plane, can solve the problems of image distortion, non-uniformity of analog-to-digital converter, affecting ADC accuracy and signal-to-noise ratio, etc., to improve uniformity and eliminate flipping Effects of Latency Inconsistency Issues

Active Publication Date: 2020-11-27
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Monoclinic ADC is one of the most commonly used column-level ADC structures. Since the uncooled infrared focal plane detector does not have a cooling device (TEC), the detector will generate temperature drift with the change of ambient temperature and heat during operation. The drift phenomenon will cause non-uniformity problems in the analog-to-digital converter, which will affect the accuracy and signal-to-noise ratio of the ADC, resulting in a decrease in detection quality and image distortion

Method used

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  • Analog-to-digital conversion device and method with substrate temperature compensation for infrared focal plane
  • Analog-to-digital conversion device and method with substrate temperature compensation for infrared focal plane
  • Analog-to-digital conversion device and method with substrate temperature compensation for infrared focal plane

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Embodiment 1

[0051] like figure 1 As shown, this embodiment provides an infrared focal plane analog-to-digital conversion device with substrate temperature compensation, including: a substrate temperature acquisition and correction module 50 and a comparator module 10 with substrate temperature compensation;

[0052] The comparator module 10 with substrate temperature compensation includes a comparator 102 and a current-mode DAC 101;

[0053] The substrate temperature acquisition and correction module 50 acquires the substrate temperature data of the infrared focal plane array and extracts corresponding relevant correction parameters based on the substrate temperature data;

[0054] The substrate temperature acquisition and correction module 50 applies relevant correction parameter signals to the current-mode DAC, and the current-mode DAC 101 regulates the tail current of the comparator 102 based on the relevant correction parameter signals to perform substrate temperature compensation.

...

Embodiment 2

[0060] This embodiment provides an analog-to-digital conversion method with substrate temperature compensation for an infrared focal plane, comprising the following steps:

[0061] T1. The substrate temperature acquisition and correction module acquires the substrate temperature information of the infrared focal plane array and extracts relevant correction parameters;

[0062] T2. The substrate temperature acquisition and correction module applies relevant correction parameter signals to the current-type DAC, and the current-type DAC regulates the tail current of the comparator based on the relevant correction parameter signals to perform substrate temperature compensation;

[0063] T3. The voltage signal to be converted is compared with the linear ramp voltage signal generated by the ramp generator in a comparator with substrate temperature compensation, and then the conversion result is output, and the conversion result is stored in the register;

[0064] T4. The register ou...

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Abstract

The invention discloses an analog-to-digital conversion device with substrate temperature compensation for an infrared focal plane. The analog-to-digital conversion device comprises a substrate temperature acquisition and correction module and a comparator module with substrate temperature compensation, and the comparator module with the substrate temperature compensation function comprises a comparator and a current type DAC. The substrate temperature acquisition and correction module acquires substrate temperature data of the infrared focal plane array and extracts corresponding related correction parameters based on the substrate temperature data; the substrate temperature acquisition and correction module applies the related correction parameter signal to a current type DAC, and the current type DAC regulates and controls the tail current of the comparator based on the related correction parameter signal to perform substrate temperature compensation. According to the scheme, the substrate temperature acquisition and correction module is additionally arranged based on the comparator, compensation of the substrate temperature of the comparator is realized by matching with the current type DAC, the problem of inconsistent overturning delay of the comparator caused by different temperatures is effectively eliminated, the offset error of the analog-to-digital converter is reduced, and the precision and the signal-to-noise ratio of the conversion device are improved, so that the uniformity of an output image is improved.

Description

technical field [0001] The invention relates to the technical field of infrared focal planes, in particular to an analog-to-digital conversion device and method for infrared focal planes with substrate temperature compensation. Background technique [0002] Compared with cooled infrared detectors, uncooled infrared focal plane detectors have many advantages such as no refrigeration, small size, simple operation, high performance and low price, and are widely used in military, industrial, medical, scientific research and other fields. The uncooled infrared focal plane array system is at a critical stage of development from a multifunctional module to a monolithic integration, especially the on-chip integration of the analog-to-digital converter (ADC). With the advancement of focal plane technology, its performance is mainly limited by the interference of crosstalk, power supply noise and some other mechanisms introduced in the signal channel. The readout circuit of the on-chi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03M1/06
CPCH03M1/06
Inventor 吕坚闵道刚邹灵乐鲁竞原阙隆成周云
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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