Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thin-wall weak-rigidity part machining and fixing method and temperature control machining platform

A processing platform, weak rigid technology, applied in machine tool parts, metal processing equipment, machine operation and other directions, to avoid stress rebound, high-precision adjustment, fast connection speed

Pending Publication Date: 2020-12-01
湖北三江航天江北机械工程有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for processing and fixing thin-walled weakly rigid parts that are easy to fix and disassemble without deformation and its temperature-controlled processing platform

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin-wall weak-rigidity part machining and fixing method and temperature control machining platform
  • Thin-wall weak-rigidity part machining and fixing method and temperature control machining platform
  • Thin-wall weak-rigidity part machining and fixing method and temperature control machining platform

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Such as Figure 1-8 As shown, the temperature-controlled processing platform for thin-walled and weakly rigid parts provided in this embodiment includes a platform frame 100 , a cooling and heating assembly and a fixing assembly 300 . in:

[0044] The platform frame 100 is composed of a panel 110 , a middle frame 120 and a bottom plate 130 , and the top and bottom of the middle frame 120 are respectively fixedly connected with the panel 110 and the bottom plate 130 by bolts.

[0045] A cooling and heating assembly is fixedly installed below the panel 110 , and the latter includes a cooling sheet group and a heat sink 220 .

[0046] The refrigerating sheet group includes a plurality of semiconductor refrigerating sheets 210 arranged in an array and installed on the lower surface of the panel 110 . The Peltier effect occurs when the semiconductor refrigeration sheet is connected with direct current. By controlling the direction of the current in and out, it can produce co...

Embodiment 2

[0054] Such as Figures 13 to 14 As shown, in this embodiment, on the basis of Embodiment 1, an adapter plate 400 is added to accommodate parts that are difficult to be fixed stably. The adapter plate 400 has an upper surface that is concavo-convex matched (complementary) to the fixed surface of the processed part 800 , so as to match and install the processed part 800 with an uneven fixed surface. The adapter plate 400 can be configured with positioning pins 420 according to needs, so as to facilitate the positioning of the processed part 800 , and the adapter plate 400 itself is fixed on the panel 110 through the pressure plate 410 and bolts. In order to improve the thermal conductivity, a thermal conductive material layer 700 (a graphite pad is used in this embodiment, not shown in the figure) is provided between the adapter plate 400 and the panel 110 to improve the heat transfer effect.

Embodiment 3

[0056] The processed part 800 is an installation base plate 130 for aerospace communication, and the material is aluminum alloy. The flatness of the part 800 and the depth of the middle step (1.5±0.06) require high accuracy. If ordinary pressing blocks or backing plates are used for clamping, the parts are easily deformed, which cannot meet the processing accuracy requirements. If a vacuum suction cup is used for clamping, springback deformation is prone to occur after processing. Even if two large planes are repeatedly turned over and clamped to process two large planes, the flatness requirements cannot be effectively guaranteed, and the efficiency is low and the pass rate is very low. For example, the general-purpose two-component adhesive clamping method at room temperature cannot meet the needs of industrial production due to the influence of many factors such as long curing time of the adhesive, difficulty in controlling the uniformity of the adhesive, and large damage to ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a thin-wall weak-rigidity part machining and fixing method and a temperature control machining platform. The temperature control machining platform comprises a platform frame body; a panel is arranged on the upper part of the platform frame body; and a refrigerating and heating assembly is fixedly installed below the panel; the refrigerating and heating assembly comprises arefrigerating sheet set and a heat dissipation device; the refrigeration sheet set comprises at least one semiconductor refrigeration sheet; the semiconductor refrigeration sheet is tightly attachedto the lower surface of the panel and can switch between a refrigeration mode and a heat dissipation mode; the heat dissipation device is tightly attached to the lower surface of the semiconductor refrigeration plate and is used for dissipating heat generated by the semiconductor refrigeration plate in the refrigeration mode. According to the method, the temperature of a bonding agent is adjustedthrough a semiconductor refrigeration plate; and when the bonding agent is solidified or softened, a machined part can be fixedly connected to the platform in a natural state, the connection speed ishigh, no extra stress is generated, stress resilience can be effectively avoided, and the machined part can be conveniently separated and taken down from the platform after the bonding agent is softened and thinned.

Description

technical field [0001] The invention relates to processing and fixing of thin-wall weakly rigid parts, in particular to a processing and fixing method of thin-wall weakly rigid parts and a temperature-controlled processing platform thereof. Background technique [0002] Weakly rigid thin-walled parts are widely used in aerospace, communication, optoelectronics and other fields. Such parts have poor rigidity and are easily deformed during processing, resulting in large processing errors and low processing accuracy. In order to improve the processing accuracy, the parts need to be fixed before the actual processing to enhance the rigidity of the parts to be processed. The fixation methods that have been adopted at present mainly include magnetic chuck, vacuum chuck and adhesive bonding. Among them, magnetic chucks can only fix magnetic parts, but cannot fix non-magnetic parts such as aluminum alloys, titanium alloys, and non-metals; vacuum chucks are prone to springback defo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23Q3/08F25B21/04
CPCB23Q3/084F25B21/04B23Q2240/005
Inventor 谢炳恒何斌刘亮苏循志万德强任晗熊贺芹肖海鹏
Owner 湖北三江航天江北机械工程有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com