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Dielectric ceramic composition and multi-layer ceramic electronic component using the same

A technology of dielectric ceramics and compositions, applied in the field of multi-layer ceramic electronic components, can solve the problems of DC bias characteristics reducing product reliability and high temperature withstand voltage characteristics, etc.

Active Publication Date: 2020-12-01
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] As mentioned above, depending on the miniaturization of multilayer ceramic capacitors, there may be problems with degradation of DC bias characteristics and product reliability and high-temperature withstand voltage characteristics

Method used

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  • Dielectric ceramic composition and multi-layer ceramic electronic component using the same
  • Dielectric ceramic composition and multi-layer ceramic electronic component using the same
  • Dielectric ceramic composition and multi-layer ceramic electronic component using the same

Examples

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Embodiment Construction

[0027] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0028] This disclosure, however, may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0029] Throughout the specification, it will be understood that when an element such as a layer, region, or wafer (substrate) is referred to as being "on," "connected to," or "bonded to" another element, When an element is used, it may be directly "on," "connected to," or "coupled to" another element, or other elements may be present therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element, there may be no intervening elements p...

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Abstract

A dielectric ceramic composition and a multilayer ceramic electronic component are provided, the dielectric ceramic composition includes a barium titanate base material main component and a subcomponent, a microstructure after sintering includes a first crystal grain including 3 or less domain boundaries and a second crystal grain including 4 or more domain boundaries, and an area ratio of the second crystal grain to the total crystal grains is 20% or less.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0064764 filed with the Korean Intellectual Property Office on May 31, 2019, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a dielectric ceramic composition and a multilayer ceramic electronic component including the dielectric ceramic composition. Background technique [0003] In general, electronic components using ceramic materials, such as capacitors, inductors, piezoelectric elements, varistors, thermistors, etc., include a ceramic body formed using a ceramic material, internal electrodes formed in the body, and surfaces mounted on the ceramic body. on the outer electrode to connect to the inner electrode. [0004] In recent years, due to the trend of miniaturization and multifunctionalization of electronic products, chip components have had a trend of miniaturization and high functional...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/30
CPCH01G4/1218H01G4/30C04B35/4682C04B2235/3213C04B2235/3208C04B2235/3244C04B2235/79C04B2235/80C04B2235/3262C04B2235/3239C04B2235/3241C04B2235/3272C04B2235/3279C04B2235/3275C04B2235/3281C04B2235/3284C04B2235/442C04B2235/3206C04B2235/3225C04B2235/3224C04B2235/3227C04B2235/3229C04B2235/3418C04B2235/36C04B2235/3201C04B2235/3203C04B2235/3267C04B2235/785C04B2235/761C04B2235/5445C04B2235/5454H01G4/1227H01G4/1245H01G4/302H01B3/12C04B35/2633C04B35/468C04B2235/407C04B35/14C04B2235/404C04B35/48
Inventor 尹硕晛金美良金珍友金东勳朴重德
Owner SAMSUNG ELECTRO MECHANICS CO LTD