Grab mechanism and transfer device for semiconductor lead frame

Abstract

A grabbing mechanism for a semiconductor lead frame, comprising: a casing, the top surface of which is arrayed with two rows of key-shaped holes along the length direction, and vertical rods are arranged inside the key-shaped holes; The bottom end of the rod is connected to drive the vertical rod to move along the length of the key hole; one end of the rotating rod is rotated on the top of the vertical rod, and the other end is vertically connected to the pneumatic suction head assembly. The pneumatic suction head assembly is used to contact the lead frame. At the same time, the lead frame is adsorbed; and the second stroke mechanism is arranged on the top surface of the housing, and is used to act on one end of the rotating rod connected to the vertical rod to drive the rotating rod to rotate. A semiconductor lead frame transfer device includes a grabbing mechanism, a rotating mechanism, and a lifting mechanism. Pneumatically acting on the body on both sides of the lead frame to achieve picking / grabbing, at the same time, the overall rotation of the rotating rod can adjust the width of the lead frame that the grabbing mechanism can adapt to, and shorten the distance between the vertical bars to fit the lead Frame length for high practicality.

Description

technical field [0001] The invention relates to the field of semiconductor components, in particular to a grasping mechanism and a transfer device for a semiconductor lead frame. Background technique [0002] Lead frame is an important carrier of semiconductor devices and integrated circuit modules. In the preparation of this type of device / module, the required wafer / chip is usually fixed on the designated area of ​​the lead frame by means of bonding, etc., and electrical conduction is achieved by bonding gold wires or setting jumpers, and then packaged. Plastic base, and corresponding cutting, punching, folding, etc. to obtain products. [0003] During the packaging process, due to the thin thickness of the lead frame and the specific holes, base islands, ribs, etc. in the middle area, it is not easy to be picked up, which is not conducive to the need for patching, gluing, fixing jumpers, testing, etc. For lead frame transfer, if the transfer efficiency is low, it will af...

AI Technical Summary

Problems solved by technology

[0003] During the packaging process, due to the thin thickness of the lead frame and the specific holes, base islands, ribs, etc. in the middle area, it is not easy to be picked up, which is not conducive to the need for patching, gluing, fixing jumpers, testing, etc. For lead frame transfer, if the transfer efficiency is low, it will affect the time consumed in the intermediate process, and picking or grabbing cannot cause damage to the lead frame, especially it is generally not recommended to transfer from the upper and lower surfaces at the same time, because this May cause physical pressure loss and bending

[0004] At present, the most commonly used solution is to use multiple pneumatic suction heads to adsorb the frame bodies on both sides of the lead frame length direction to achieve picking / grabbing. However, in actual production, lead frames of various models and specifications will be faced, such as Lead frames with different rows have different widths and lengths. At this time, the current suction heads cannot directly correspond, and need to be adjusted, and the adjustment needs to be adjusted individually for each suction head position. At present, it cannot be adjusted automatically at the same time. The pure manual method cannot achieve the effect of adjusting and matching, and it is necessary to improve

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