Silicone coating device with protecting and clamping functions for computer chip production

Abstract

The invention relates to a silicone coating device with protecting and clamping functions for computer chip production. The silicone coating device comprises a bottom plate and a first spring, whereina first motor and a second motor are sequentially installed at the lower end of the bottom plate from left to right; a workbench is connected to the upper end of a rotating shaft; a computer chip body is placed at the upper end of the workbench; baffle blocks are arranged at one side, close to the central axis of the workbench, of the computer chip body; clamping blocks are arranged at two sidesof the computer chip body; threaded rods are connected with the interior of the clamping blocks; two ends of the threaded rods are connected with a clamping box through bearings; and a first gear is fixed to the middles of the threaded rods. The silicone coating device with the protecting and clamping functions for computer chip production has the beneficial effects that a silicone liquid can be applied more uniformly through a brush, and meanwhile, redundant silicone liquid on the coated computer chip can be sucked and recycled under negative pressure through a return pipe, so that the wasteof the silicone liquid can be prevented, and the production cost can be reduced.

Description

Technical field [0001] The present invention relates to the field of computer chip adhesion technique, particularly as a computer chip having a protective gumming device production clamping function. Background technique [0002] In fact, a computer chip electronic component comprises a resistor-capacitor and other thousands of small elements in a computer chip, there are many chips on a computer, RAM On a piece of black bar is on the chips, motherboards, hard drives, graphics cards and so have a lot of chips, CPU also block computer chips, but his complex than an ordinary computer chip more more precision, computer chips required during installation coated with silica gel, thereby facilitating computer chip cooling. [0003] For the production of computer chips when conventional adhesive, mostly applied directly to the glue computer chips followed by natural drying, smear is not easy to directly control the release of an amount of plastic, spreadable multi wasteful, but also pro...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of gluing device with protective clamping function for the production of computer chips, to solve the problem of gluing in the production of existing computer chips proposed in the above-mentioned background technology, most of which are directly smearing the glue to the computer chips Put it on and then dry it naturally. It is not easy to control the amount of glue for demoulding by direct application. It is easy to apply too much and cause waste. It is also prone to uneven application and affects the heat dissipation of computer chips.

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