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Chip gluing method and device and glue uniformizing machine

A glue leveling machine and chip technology, which is applied to the surface coating liquid device, coating, etc., can solve the problems of incomplete glue coating, chip undercutting, and reduced corrosion resistance of photoresist, so as to avoid undercutting , to avoid the effect of reducing corrosion resistance

Active Publication Date: 2020-12-15
JILIN SINO MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some common surface gluing treatment technologies, when gluing the surface of the chip, often have the problem of incomplete gluing coverage, which will lead to the problem of reduced corrosion resistance of the photoresist during the distributed corrosion process, resulting in chip undercutting

Method used

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  • Chip gluing method and device and glue uniformizing machine
  • Chip gluing method and device and glue uniformizing machine
  • Chip gluing method and device and glue uniformizing machine

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Embodiment Construction

[0048]In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the appended The figures are only for the purpose of illustration and description, and are not used to limit the protection scope of the present application. Additionally, it should be understood that the schematic drawings are not drawn to scale. The flowcharts used in this application illustrate operations implemented in accordance with some of the embodiments of this application. It should be understood that the operations of the flowcharts may be performed out of order, and steps that have no logical context may be performed in reverse order or concurrently. In addition, those skilled in the art may add one or more other opera...

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Abstract

The embodiment of the invention relates to the technical field of semiconductor chip processing, in particular to a chip gluing method and device and a glue uniformizing machine. According to the embodiment of the invention, firstly, a first glue uniformizing process is started on the basis of a preset first control parameter, and the first time of glue uniformizing is conducted on a target chip;and then a second glue uniformizing process is started on the basis of a preset second control parameter, and the second time of glue uniformizing is conducted on the target chip obtained after the first time of glue uniformizing treatment so as to achieve the two times of glue uniformizing treatment, wherein the viscosity of first photoresist adopted in the first glue uniformizing process is higher than that of second photoresist adopted in the second glue uniformizing process. In this way, it can be ensured that the photoresist can completely cover the surface of the target chip, the problemthat the corrosion resistance of the photoresist is reduced in the distribution corrosion process is avoided, and then the target chip is prevented from undercutting.

Description

technical field [0001] The present application relates to the technical field of semiconductor chip processing, and in particular, to a method, device, and glue spreader for chip gluing. Background technique [0002] Semiconductor chips have the advantages of small size, light weight, low power consumption, and good conductivity. One of the main reasons for these advantages is based on the surface passivation technology of the semiconductor chip, and the protective film is coated on the surface of the PN junction to prevent the surface of the PN junction from being polluted by the ambient atmosphere and foreign impurity ions. [0003] After the surface passivation treatment of the semiconductor chip, the subsequent process will involve the chip surface coating treatment. Some common surface gluing treatment technologies, when gluing the surface of the chip, often have the problem of incomplete gluing coverage, which will lead to the problem of reduced corrosion resistance o...

Claims

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Application Information

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IPC IPC(8): B05C11/10B05C5/02B05C9/10B05C9/12B05C9/14
CPCB05C5/0208B05C9/10B05C9/12B05C9/14B05C11/1005
Inventor 于航马占良董善伟李铁男沙世奇
Owner JILIN SINO MICROELECTRONICS CO LTD
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