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Pre-embedded full hole plugging method of printed circuit board

A technology for printed circuit boards and plug holes, which is used in printed circuits, printed circuits, and printed circuit manufacturing. Foaming problem, the effect of eliminating foaming

Active Publication Date: 2020-12-22
江西领德辉电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most of the traditional circuit board buried hole or through hole plugging methods use the direct printing method of the plug hole material, which is often prone to blistering or tin bead problems, which seriously affects the quality of the circuit board plug hole

Method used

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  • Pre-embedded full hole plugging method of printed circuit board
  • Pre-embedded full hole plugging method of printed circuit board
  • Pre-embedded full hole plugging method of printed circuit board

Examples

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Embodiment 1

[0043] see figure 1 A method for pre-embedded full plugging holes of a printed circuit board, wherein the printed circuit board is provided with at least one through hole to be plugged, comprising the following steps:

[0044] S1. Pre-embed the plugging rod 1 into the through hole of the printed circuit board, and keep the vertical state after adjusting the position;

[0045] S2. Carry out film-sticking treatment to one end surface of the printed circuit board, and cover with a protective film;

[0046] S3. Print the plug hole material on the printed circuit board where the protective film is exposed, and ensure that the plug hole material completely covers the through hole;

[0047] S4. After the plugging is completed, the printed circuit board is heated and solidified, and the plugging rod 1 expands in the through hole to seal the through hole, and performs local fretting to eliminate air bubbles;

[0048] S5. After the plug hole material is completely cured, the protectiv...

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Abstract

The invention discloses a pre-embedded full hole plugging method for a printed circuit board, belongs to the technical field of circuit board manufacturing. According to the invention, a mode of pre-embedding a hole plugging rod in a through hole is innovatively adopted, then a printed hole plugging material is used for filling, and in the heating and curing process, heat is used for triggering the hole plugging action of the hole plugging rod; freedom of the defoaming ball is recovered based on the phase change characteristic of the phase change rod, high-frequency vibration is conducted under the elastic action, the defoaming wires extending into the hole plugging material are promoted to vibrate, bubbles in the hole plugging material can be effectively eliminated, escape of air in the hole plugging material to the outside is accelerated; meanwhile, during final curing, the defoaming rod body is extruded under the magnetic attraction matching effect of the defoaming wire and the phase change rod, air in the defoaming rod body is extruded into the plugging ball head to start expanding, openings in the two ends of the through hole are plugged, and tin beads are prevented from entering the through hole; compared with a conventional hole plugging method, the hole plugging quality can be remarkably improved, and the foaming problem and the tin bead problem are solved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for pre-embedded full plugging of printed circuit boards. Background technique [0002] With the rapid development of electronic communication technology and electronic products, the circuit board design is getting thinner and thinner, and the thickness of the finished circuit board is 0.40mm or even lower. In the current development of circuit boards, thin plates have gradually become the trend of circuit board development, and thin plate technology has become a constraint that restricts traditional circuit board technology. The main feature of thin circuit boards is the thin dielectric layer. Generally, the thickness of the interlayer is controlled at 60um to 70um. Some thin board manufacturers have been able to achieve less than 55um. This brings great challenges to the production of traditional circuit boards, especially for lamination. And plug ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0094H05K2201/09563
Inventor 劳业鸿
Owner 江西领德辉电路有限公司
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