Method for establishing virtual model of hot air reflow oven based on finite element simulation

Abstract

The invention discloses a method for establishing a virtual model of a hot air reflow oven based on finite element simulation, which comprises the following steps of: establishing a reflow soldering simulation process of the virtual model of the hot air reflow oven by applying a basic principle of heat transfer science and combining a finite element transient thermal simulation analysis tool; acquiring a temperature curve of the test board in a full-temperature area in the hot air reflow oven in a real hot air reflow oven reflow soldering process by using a temperature measurement board, measuring physical parameters of the hot air reflow oven, and calculating to obtain an average convective heat transfer coefficient of each temperature area of the hot air reflow oven virtual model by combining an impact jet theoretical meter; designing an external interface for the hot air reflow oven virtual model; acquiring size parameters and heating zone length of a real hot air reflow oven, and correcting the number of temperature zones and the interval length of the temperature zones of the hot air reflow oven virtual model according to the size parameters and the length. By means of the technical scheme, the technological parameters of the hot air reflowing furnace can be rapidly and reasonably designed, and the problems that the technological parameter design period is long, and cost is high are solved.

Description

technical field [0001] The invention relates to the technical field of reflow soldering, in particular to a method for establishing a virtual model of a hot air reflow furnace based on finite element simulation. Background technique [0002] The reflow soldering process is the key process of the reflow soldering process. Most of the PCBA printed board assembly reflow soldering defects are caused by the unreasonable setting of the reflow soldering process parameters, and the existing reflow soldering The process parameter design is to design the physical printed board components repeatedly through the reflow furnace that needs to set the process parameters, and then collect the temperature curve through the furnace temperature tester and other tools, and use the "trial and error method" to gradually approach the ideal (or acceptable) target curve. So as to realize the process parameter setting of the reflow furnace. [0003] This method is better applied in the field of lead...

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Problems solved by technology

[0006] In view of the above problems, the present invention provides a method for establishing a virtual model of a hot air reflow oven based on finite element simulation. By analyzing the state of the real hot air reflow oven, and then applying the basic principles of heat transfer, hot air convection theory, and impact jet theory, the reflow is realized. The reflow soldering simulation process of the furnace virtual model is established. Through the physical parameters of the real hot air reflow furnace and the temperature curve of the reflow process, a virtual model of the reflow soldering hot air reflow furnace is constructed to quickly and reasonably design the process of the hot air reflow furnace Parameters, to solve the problem of long design cycle and high cost of hot air reflow furnace process parameters under lead-free and lead-free mixed assembly and pure lead-free assembly reflow soldering process

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