Full-automatic circuit board horizontal electroless plating copper connecting wire VCP electroplating device
A technology of electroplating equipment and circuit boards, which is applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc.
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[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0034] see Figure 1-7 As shown, the present invention is a fully automatic circuit board horizontal copper sinking connection VCP electroplating device, including a horizontal copper sinking production line 100, a VCP plating line 300, and a transposition frame is arranged between the horizontal copper sinking production line 100 and the VCP plating line 300 1. A transposition plate 3 is slidably installed on the transposition frame 1, a guide cylinder 5 is instal...
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