Full-automatic circuit board horizontal electroless plating copper connecting wire VCP electroplating device

Abstract

The invention discloses a full-automatic circuit board horizontal electroless plating copper connecting line VCP electroplating device, and the device comprises a horizontal electroless plating copperproduction line and a VCP electroplating line; a transposition frame is arranged between the horizontal electroless plating copper production line and the VCP electroplating line, a transposition plate is slidably installed on the transposition frame, a guide air cylinder is installed on the transposition plate, and a lifting plate is installed at the end of a piston rod of the guide air cylinder; two translation plates are slidably mounted on the lifting plate, two connecting plates are mounted on the translation plates, first adjusting shells are mounted on the connecting plates, two firstadjusting blocks are slidably mounted in the first adjusting shells, convex blocks are mounted on the first adjusting blocks, second adjusting shells are mounted on the convex blocks, and two second adjusting blocks are slidably mounted in the second adjusting shells; and a limiting plate is mounted on the second adjusting blocks. Circuit boards with different thicknesses and widths are clamped, the two sides, the upper point position and the lower point position of each circuit board are clamped at the same time, and the situation that the circuit boards fall off in the transposition processis avoided.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a fully automatic circuit board horizontal sinking copper connection VCP electroplating device. Background technique [0002] The circuit board electroplating process is an essential and important process in the circuit board production process, including two processes of copper sinking and hole filling / thickening. The copper sinking process uses chemical methods to sink a layer in the hole of the plate after drilling Conductive material, the hole filling / thickening process thickens the copper in the hole and on the surface of the board, and the hole filling process uses copper to fill the hole. [0003] The patent document (CN201721087394.4) discloses a fully automatic circuit board horizontal sinking copper connection VCP electroplating device, which is used for the electroplating process in the circuit board production process, and the production process reali...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of fully automatic circuit board horizontal sinking copper connection VCP electroplating device, solve the following technical problems: (1) by placing circuit boards on the horizontal copper sinking production line in sequence, the circuit boards are processed through the horizontal copper sinking production line Then enter under the transposition frame, open the transposition cylinder, the piston rod of the transposition cylinder drives the transposition board to move above the circuit board, open two translation cylinders, the piston rod of the translation cylinder pushes the translation plate, and the two translation plates drive the two connecting plates Move in reverse, open the guide cylinder, the piston rod of the guide cylinder pushes down the lifting plate, the lifting plate drives the two connecting plates down, the two connecting plates drive the four first regulating shells down, and the four first regulating shells descend to the circuit board On both sides, turn on four adjusting motors one, the output shaft of adjusting motor one drives the first screw to rotate, the first screw drives the two first adjusting blocks to move toward each other, the piston rods of the two translational cylinders shrink, and the four first adjusting shells Clamp both sides of the circuit board, through the above structure, the fully automatic circuit board horizontal copper sinking connection VCP electroplating device is set by the transposition frame, so that the circuit board between the horizontal copper sinking production line and the VCP electroplating line can be transposed It will be more convenient, and the whole transposition process is automated without manual participation; (2) open four regulating motors two, and the output shafts of the regulating motors two drive the second lead screw to rotate, and the second lead screw drives the two second regulating blocks to move toward each other, and the two A second adjustment block clamps the upper and lower sides of the circuit board, and then the piston rod of the guiding cylinder shrinks, the lifting plate rises, the piston rod of the transposition cylinder pushes the transposition plate, the transposition plate moves to the top of the VCP plating line, and the guiding cylinder The piston rod pushes down the lifting plate, and the circuit board is placed on the VCP electroplating line. Through the above structural settings, the automatic circuit board horizontal sinking copper connection VCP electroplating device can meet the clamping of circuit boards of different thicknesses and widths. Clamping at multiple points on both sides and up and down at the same time will not cause the circuit board to fall during the transposition process; (3) The output shaft of the lifting motor drives the third lead screw to rotate, and the third lead screw drives the support plate The support plate drives the receiving plate to descend, and the receiving plate motor is turned on. The output shaft of the receiving plate motor drives the bevel gear to rotate. The bevel gear one cooperates with the bevel gear two to drive the gear to rotate. In the VCP electroplating line, the circuit board moves to the negative pressure suction cup on the receiving plate after being processed by the VCP electroplating line. The output shaft of the lifting motor drives the third lead screw to rotate in the opposite direction. The receiving board rises, the receiving board drives the circuit board to rise, and the two receiving board cylinders are opened, the piston rod of the receiving board cylinder pushes the fixing bar, and the fixing bar drives the two clamping cylinders to move, and the four clamping cylinders are opened to clamp the piston of the cylinder The lever drives the clamping plate to move, and the four clamping plates clamp the two sides of the circuit board, and the motor for retracting the board is turned on. The output shaft of the motor for retracting the board drives the gear 2 to rotate, and the gear 2 cooperates with the rack 2 to drive the hanging plate to move, and the circuit board is placed on the On the receiving car, through the above structural settings, the fully automatic circuit board horizontal copper connection VCP electroplating device can efficiently place the electroplated circuit board on the receiving car, and the whole process does not require operator participation. Negative pressure suction cup design makes the receiving process of circuit boards more efficient

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