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Sealing structure, vacuum processing apparatus and sealing method

A sealing structure and vacuum technology, which is applied in vacuum evaporation coating, engine sealing, mechanical equipment, etc., can solve problems such as penetration, and achieve the effect of suppressing atmospheric penetration

Active Publication Date: 2021-01-05
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in a sealing structure using such an elastomer O-ring, there is a problem that air permeates through the gas permeating the O-ring, for example, and thus a sealing structure that suppresses air permeation is required.

Method used

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  • Sealing structure, vacuum processing apparatus and sealing method
  • Sealing structure, vacuum processing apparatus and sealing method
  • Sealing structure, vacuum processing apparatus and sealing method

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0037]A film forming apparatus using the sealing structure of the present invention will be described. Such asfigure 1 As shown, the film forming apparatus includes: a vacuum chamber 10, which is a processing chamber for processing a semiconductor wafer (hereinafter referred to as "wafer") W as a substrate in a vacuum atmosphere; and a processing chamber for supplying processing to the vacuum chamber 10 Gas supply pipe 4 for gas. Furthermore, as described later, the gas supply piping 4 is configured by connecting a plurality of piping members (the first member 4A, the second piping member 4B), and is provided with a gas supply piping for suppressing the entry of air into the gas supply piping through the connection parts of these piping members. 4 internal sealing structure.

[0038]The vacuum chamber 10 includes: a substantially cylindrical chamber body 10A with an open upper surface; and a top plate portion 10B that closes the upper surface of the chamber body 10A. A cylindrical exha...

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PUM

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Abstract

The invention provides a sealing structure, a vacuum processing apparatus and a sealing method. The sealing structure for a gas supply pipe connected to a processing chamber that processes a substratein a vacuum atmosphere includes a first pipe member that constitutes the gas supply pipe and has an end surface in which an opening that communicates with the processing chamber is formed; a second piping member that constitutes the gas supply piping and has an opposing surface disposed at a position facing the end surface of the first piping member; an elastic sealing member provided between anend surface of the first pipe member and an opposing surface of the second pipe member so as to surround the opening; and a sheet-like porous member provided between the end surface of the first pipemember and the facing surface of the second pipe member so as to surround the periphery of the sealing member. The purpose of the present invention is to suppress air permeation when sealing is performed by using the sealing member made of an elastomer.

Description

Technical field[0001]The invention relates to a sealing structure, a vacuum processing device and a sealing method.Background technique[0002]In the manufacturing process of a semiconductor device, for example, a vacuum processing apparatus that processes a substrate in a vacuum atmosphere is used in a film formation process or the like. Such a vacuum processing apparatus is provided with a vacuum chamber that forms a vacuum atmosphere; a gas supply pipe that supplies a film-forming gas to the vacuum chamber; and piping for exhausting air from the vacuum chamber. Therefore, when assembling a vacuum processing apparatus by connecting parts constituting such a vacuum chamber or pipe, in order to prevent air from flowing into the vacuum chamber or pipe from the connection portion, a sealing structure that seals the connection portion is used.[0003]When the opening of the vacuum chamber is hermetically sealed in this kind of sealing structure, an O-ring that abuts against the sealing sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16L39/00C23C14/56H01L21/67
CPCF16L39/005C23C14/56H01L21/67126H01L21/67017H01L21/67103C23C16/45561C23C16/4409F16J15/104F16J15/064H01L21/67098
Inventor 饭塚八城渡边将久我妻雄一郎
Owner TOKYO ELECTRON LTD