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Heat dissipation control circuit, heat dissipation back splint and mobile terminal

A control circuit and control terminal technology, applied in the direction of electrical components, telephone structures, electrical equipment components, etc., can solve the problems of single structure, limited heat dissipation effect, bad experience, etc., to achieve the effect of enhancing heat dissipation performance and improving user experience

Active Publication Date: 2021-01-05
厦门盈瑞丰电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing technology, with the rapid development of smart terminal equipment technology, users have higher and higher data processing requirements for smart terminals, for example, using smart terminals to perform graphics and image processing operations, or to play large-scale two-dimensional and three-dimensional games, etc. , this type of operation requires high resource processing requirements for smart terminals. At the same time, limited by the power consumption control technology of the current chip, when performing the above tasks, it may bring users a bad experience that the back of the device is hot.
[0003] In the prior art, a batch of cooling back clips have been introduced to solve the problem of heating the back shell of the smart terminal, and this type of cooling back clip is usually composed of a fan and a heat sink. This type of cooling back clip has a single structure And fixed, the heat dissipation effect brought by it is limited, only one side of the air can be discharged, and it cannot be adjusted according to the heat source and heat state of the smart device, and the user experience is not good

Method used

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  • Heat dissipation control circuit, heat dissipation back splint and mobile terminal
  • Heat dissipation control circuit, heat dissipation back splint and mobile terminal
  • Heat dissipation control circuit, heat dissipation back splint and mobile terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] image 3 It is the first circuit diagram of the first embodiment of the heat dissipation control circuit of the present invention. This embodiment proposes a heat dissipation control circuit, which includes: PMOS transistor Q1, NMOS transistor Q2, PMOS transistor Q3, NMOS transistor Q4, and NMOS transistor Q5, wherein the source and gate of the PMOS transistor Q1 A resistor R1 is connected in parallel, the gate of the PMOS transistor Q1 is connected to the control terminal of the power supply chip, the source of the NMOS transistor Q2 is connected to the positive pole of the fan, the drain of the NMOS transistor Q2 is grounded, and the drain of the NMOS transistor Q2 The gate is connected to the control terminal, the source of the NMOS transistor Q2 is connected to the power supply terminal of the power chip, the gate of the NMOS transistor Q2 is connected to the source of the NMOS transistor Q5, and the PMOS transistor The drain of Q3 and the source of the NMOS transi...

Embodiment 2

[0052] Figure 4 It is the second circuit diagram of the second embodiment of the heat dissipation control circuit of the present invention. Based on the above embodiment, optionally, if the control terminal outputs a low level (L), the gate of the PMOS transistor Q3 is at a low level, The PMOS transistor Q3 works in an on state, the power terminal outputs to the anode through the PMOS transistor Q3, the gate of the NMOS transistor Q2 is at a low level, and the NMOS transistor Q2 works in an off state, so The power supply voltage of the positive pole is provided by the power supply terminal.

[0053] Optionally, the source of the NMOS transistor Q5 is pulled up to the power supply terminal by the pull-up resistor R2, the gate of the PMOS transistor Q3 is at a high level, and the PMOS transistor Q3 works in an off state, so The power supply terminal no longer outputs to the positive pole through the PMOS transistor Q3.

[0054] Optionally, the gate of the NMOS transistor Q4 i...

Embodiment 3

[0057] Figure 5 It is the third circuit diagram of the third embodiment of the heat dissipation control circuit of the present invention. Based on the above embodiment, optionally, if the control terminal outputs a high level, the gate of the PMOS transistor Q3 is at a high level, and the PMOS The transistor Q3 works in a cut-off state, and the power terminal no longer outputs to the positive pole through the PMOS transistor Q3.

[0058] Optionally, the gate of the NMOS transistor Q2 is at a high level, the NMOS transistor Q2 works in a conduction state, and the power supply voltage of the anode is a ground voltage.

[0059] Optionally, the gate of the NMOS transistor Q5 is at a high level, the NMOS transistor Q5 works in a conduction state, the source of the NMOS transistor Q5 is at a low level, and the gate of the PMOS transistor Q3 is at a low level , the PMOS transistor Q3 works in a conduction state, and the power terminal outputs to the negative electrode through the P...

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Abstract

The invention discloses a heat dissipation control circuit, a heat dissipation back splint and a mobile terminal, and provides the heat dissipation control circuit which respectively outputs high andlow level signals through the control end of a power supply chip so as to realize power supply switching selection of a positive power supply and a negative power supply in the fan power supply process, that is, forward rotation and reverse rotation of the fan are achieved, so that the heat dissipation opening and the air inlet which flow through the terminal device can be exchanged according to actual heat dissipation requirements, on one hand, the corresponding heat dissipation opening and the corresponding air inlet can be adjusted according to the heat dissipation requirements, and therefore the heat dissipation performance is enhanced; and on the other hand, when the air temperature is high, the hands of a user are prevented from being burnt by hot air of the heat dissipation openings, or when the air temperature is low, the hands of the user can be heated through the hot air of the heat dissipation openings, and therefore the user experience is improved.

Description

technical field [0001] The invention relates to the field of mobile communication, in particular to a heat dissipation control circuit, a heat dissipation back clip and a mobile terminal. Background technique [0002] In the existing technology, with the rapid development of smart terminal equipment technology, users have higher and higher data processing requirements for smart terminals, for example, using smart terminals to perform graphics and image processing operations, or to play large-scale two-dimensional and three-dimensional games, etc. , this type of operation requires high resource processing requirements for smart terminals. At the same time, limited by the current power consumption control technology of the chip, when performing the above tasks, it may bring bad experience to the user that the back of the device becomes hot. [0003] In the prior art, a batch of cooling back clips have been introduced to solve the problem of heating the back shell of the smart ...

Claims

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Application Information

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IPC IPC(8): H04M1/18H04M1/21H05K7/20
CPCH04M1/18H04M1/21H05K7/20209H05K7/20136Y02D10/00
Inventor 蒋权
Owner 厦门盈瑞丰电子科技有限公司
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