Cooling liquid collecting and separating device of diamond wire silicon wafer cutting machine

A separation device and cooling liquid technology, applied in the direction of fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of high cost, inability to collect cooling liquid and silicon powder, etc., and achieve the effect of saving resources and costs

Inactive Publication Date: 2021-01-08
ZHEJIANG OYA OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a cooling liquid collection and separation device for a diamond wire silicon wafer cutting machine, which has t

Method used

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  • Cooling liquid collecting and separating device of diamond wire silicon wafer cutting machine
  • Cooling liquid collecting and separating device of diamond wire silicon wafer cutting machine
  • Cooling liquid collecting and separating device of diamond wire silicon wafer cutting machine

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] see Figure 1-6 , a coolant collection and separation device for a diamond wire silicon wafer cutting machine, comprising a support foot 1, the top of the support foot 1 is rotatably connected to a filter box 2 through a bearing, and a filter hole is provided on the side wall of the filter box 2, and a filter layer is installed in it 7, and the left side of the filter box 2 is located between the filter layer 7 and the bottom plate 6, and a water outlet...

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Abstract

The invention relates to the technical field of solar photovoltaic panel production equipment, and discloses a cooling liquid collecting and separating device of a diamond wire silicon wafer cutting machine. The cooling liquid collecting and separating device comprises supporting legs, a filter box, a collector, a silicon powder collecting box and a cooling liquid collecting box. A bottom plate, afilter layer and a sliding groove are connected into the filter box. A partition plate is connected into the sliding groove. A collecting pipe is connected to the bottom of the partition plate. A baffle is connected to the top of the inside of the collecting pipe. A rotating column is connected to the outer side of the collecting pipe. The sliding groove is formed in the outer side of the rotating column, and a sliding rod is connected into the sliding groove. A transmission gear is connected to the bottom of the outer side of a driving column. The bottom of the inside of the filter box is connected with a motor. According to the cooling liquid collecting and separating device of the diamond wire silicon wafer cutting machine, the motor drives the transmission gear to rotate, the transmission gear drives the filter box to rotate through a fluted disc in the filter box to generate centrifugal force, and cooling liquid and silicon powder are separated through a filter layer, so that thecooling liquid and the silicon powder are respectively collected, the cooling liquid is repeatedly used, resources are saved and cost is reduced.

Description

technical field [0001] The invention relates to the technical field of solar photovoltaic panel production equipment, in particular to a cooling liquid collection and separation device for a diamond wire silicon wafer cutting machine. Background technique [0002] Solar panels are devices that directly or indirectly convert solar radiation into electrical energy through photoelectric or photochemical effects by absorbing sunlight. However, due to the high cost of solar panels, their popularity is still limited. Solar photovoltaic panels are mainly made of silicon wafers. [0003] The silicon block is cut by a diamond wire cutting machine to obtain silicon wafers. In order to prevent the high temperature fusing of the diamond wire caused by friction during cutting, the equipment will spray coolant during cutting to cool the silicon block and rinse the silicon block at the same time to avoid Silica fume from cutting wears out equipment. Most of the diamond wire cutting machi...

Claims

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Application Information

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IPC IPC(8): B28D5/00B28D5/04
CPCB28D5/04B28D5/007
Inventor 朱兰芬
Owner ZHEJIANG OYA OPTOELECTRONICS TECH
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