Wafer centering mechanism, wafer transmission device and wafer thinning equipment

Abstract

The invention discloses a wafer centering mechanism, a wafer conveying device and wafer thinning equipment. The wafer centering mechanism comprises a fixed table, a rotary driving mechanism, a bevel gear assembly, a preset number of ball screw assemblies and a preset number of movable clamping assemblies, wherein the preset number of ball screw assemblies are evenly installed on the fixed table inthe circumferential direction and arranged in the horizontal direction, the linear motion ends of the ball screw assemblies are connected with the mobile clamping assemblies, the ball screw assemblies are located on the periphery of the bevel gear assembly, the rotating ends of the ball screw assemblies are fixedly connected with the bevel gear assembly, and the bevel gear assembly is fixedly connected with the rotary driving mechanism located below the bevel gear assembly.

Description

technical field [0001] The invention relates to the technical field of wafer thinning, in particular to a wafer centering mechanism, a wafer transmission device and wafer thinning equipment. Background technique [0002] At present, the semiconductor industry uses electronic circuits such as IC (Integrated Circuit, integrated circuit) or LSI (Large Scale Integration, large scale integrated circuit) formed on the surface of the semiconductor wafer to manufacture semiconductor chips. Before the wafer is divided into semiconductor chips, the wafer is ground to a predetermined thickness by grinding the back surface of the wafer opposite to the device surface on which the electronic circuit is formed. [0003] Wafer alignment control is one of the important links in the integrated circuit manufacturing process. During the process of wafer transfer at each station, higher requirements are required for its position. When the wafer position deviates from the preset position, failu...

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Problems solved by technology

When the wafer position deviates from the preset position, failures such as failure of the manipulator to pick and place wafers will occur

[0004] During the wafer grinding process, the wafer needs to be transferred from the transfer device to the grinding table. When there is a deviation between the center of the wafer and the center of the transfer device, the wafer transfer robot will also bring the deviation to the grinding table Above; Generally, the grinding table is a ceramic suction cup structure, and the suction area of ​​the suction cup is close to the diameter of the wafer. Once there is a deviation between the center of the wafer and the center of the grinding table, the vacuum pressure of the suction cup will be insufficient. More serious accidents such as slides

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