Glue-injected high-efficiency heat-dissipating mobile phone case and manufacturing method thereof

Abstract

The invention discloses a plastic injection type high-efficiency heat-dissipating mobile phone case and a manufacturing method thereof. The mobile phone case is divided into four parts, which are a flexible hollow high thermal conductivity base, a core filler, and a hanger for fixing with the back shell of the mobile phone. A buckle structure and a high thermal conductivity sealing cover plate corresponding to the position of the heating area of ​​the mobile phone and adapted to the opening portion of the flexible hollow high thermal conductivity base; wherein the flexible hollow high thermal conductivity base is made of nylon 12, polyphenylene sulfide, and high-density polyethylene. As the matrix, three functional fillers of carbon fiber tube, alumina powder and silicon carbide particles are solidified in it; the total height range of the high thermal conductivity sealing cover plate is 2.25mm-2.5mm, the length and width are suitable for the mobile phone it is suitable for, and the height The heat-conducting sealing cover plate is specifically composed of a thick outer cover plate, a thick inner cover plate, a wave plate and a working medium circulating in the gaps of the three plates, wherein the working medium is deionized water. The invention has overall flexibility, dual heat dissipation, self-adaptation, anti-aging and high efficiency.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electrical equipment, in particular to a plastic injection type high-efficiency heat dissipation mobile phone case and a manufacturing method thereof. Background technique [0002] The high heat flux density generated inside power electronic devices poses a great threat to the reliability of the device. Since the failure caused by high temperature accounts for more than 50% of all electronic equipment failures, the heat transfer problem has even become a bottleneck in the development of the device towards miniaturization. In addition to the requirements for the highest temperature of electronic components, the uniformity of temperature is also required. With the rapid development of microelectronics technology, the miniaturization of electronic devices has become the mainstream trend in the development of modern electronic devices. The feature size of electronic devices is continuous...

AI Technical Summary

Problems solved by technology

[0004] Using flat heat pipes to effectively solve the heat dissipation problem of high heat flux electronic devices in small spaces is an important development direction of heat pipes. How to achieve higher performance flat heat pipes has become a hot issue in this field, but there is no design specifically for mobile phones on the market. External heat pipe composite cooling device

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