High-stability packaging lead frame and packaging part production method

Abstract

The invention discloses a high-stability packaging lead frame, a packaging part production method and a packaging lead frame, and the packaging lead frame comprises a lead bonding pad, a wiring groove, a slide holder, a wiring assembly, a bonding groove, a silver paste sheet, a bonding sheet and a protection assembly, and the end surface of the lead bonding pad is provided with the protection assembly. A slide holder is welded and mounted on one side of the top end surface of the lead bonding pad, a bonding groove is formed in the center of the end surface of the slide holder, a silver paste sheet is arranged on the end surface of the bonding groove, and a bonding sheet is fixedly mounted in the center of the end surface of the silver paste sheet; according to the invention, the packaginglead frame is stable in structure and good in heat dissipation effect; the wiring pins are subjected to modular processing, so that the pins can be mounted according to use requirements, the mountingis convenient, the connection is firm, and the electrical conductivity is good; meanwhile, in the production process of the packaging piece, the process is simple, stress in the packaging piece can beeffectively eliminated, the optical detection effect of a finished product is good, and the situation of optical detection errors can be effectively reduced.

Description

technical field [0001] The invention relates to the technical field of chip packaging technology, in particular to a high-stability package lead frame and a production method for a package. Background technique [0002] Packaging lead frame refers to the shell used for installing semiconductor integrated circuit chips, which plays the role of placing, fixing, sealing, protecting chips and enhancing electrothermal performance; the packaging lead frame in the prior art has simple and simple functions, single function, and stable overall structure Poor performance, easy to damage, which affects the normal operation of the chip; at the same time, in the process of packaging, when the finished product is inspected, the optical inspection equipment has a single function, the effect of optical inspection is poor, and it is easy to make mistakes in optical inspection. Therefore, the design A highly stable package lead frame and package production method is necessary. SUMMARY OF TH...

AI Technical Summary

Problems solved by technology

[0002] Encapsulation lead frame refers to the shell used to install semiconductor integrated circuit chips, which plays the role of placing, fixing, sealing, protecting chips and enhancing electrothermal performance; in the prior art The lead frame of the package is simple and crude, with single function, poor overall structure stability, and easy damage, thus affecting the normal operation of the chip; The effect is poor, and it is prone to light inspection errors. Therefore, it is necessary to design a high-stability package lead frame and package production method

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