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Tin alloy plating solution

A technology of tin alloy and plating solution, applied in the direction of organic chemistry, etc., can solve the problems of easy decomposition and precipitation of silver, etc., to achieve good water solubility, good appearance and uniformity of film thickness, excellent electrolytic stability and stability over time. Effect

Active Publication Date: 2021-01-15
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the complexing agents shown in Patent Documents 1 to 4 have the problem of being easy to decompose and deposit silver when the plating bath is used for a long time or the plating solution is stored for a long time.

Method used

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Examples

Experimental program
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Effect test

no. 1 Embodiment approach ＞

[0044] The tin alloy plating solution of the first embodiment contains a soluble tin salt, a soluble salt of a metal less oxidizable than tin, and a sulfur compound represented by the above general formula (1). This tin alloy plating solution may further contain additives.

[0045] 〔Soluble tin salt〕

[0046] The soluble tin salt used in the tin alloy plating solution of the first embodiment is a salt that dissolves in water and generates divalent tin ions. Examples of soluble tin salts include halides, sulfates, oxides, alkanesulfonates, arylsulfonates and alkanolsulfonates. Specific examples of alkanesulfonate include methanesulfonate and ethanesulfonate. Specific examples of arylsulfonate include benzenesulfonate, phenolsulfonate, cresolsulfonate and toluenesulfonate. Specific examples of alkanol sulfonates include isethionates.

[0047] The soluble tin salt may be used alone or in combination of two or more. The content of the soluble tin salt in the tin alloy plating...

no. 2 Embodiment approach ＞

[0077] The tin alloy plating solution of the second embodiment contains a soluble tin salt, a soluble salt of a metal less oxidizable than tin, and a sulfur compound represented by the general formula (2). This tin alloy plating solution may further contain additives.

[0078] The soluble tin salt contained in the tin alloy plating solution of the second embodiment, the soluble salt of a metal less oxidizable than tin, and the additive are the same as the soluble tin salt contained in the tin alloy plating solution of the first embodiment, the soluble salt less oxidizable than tin The metal soluble salts and additives are the same, so repeated explanations are omitted.

[0079] [Sulfur compound represented by general formula (2)]

[0080] The sulfur compound used in the tin alloy plating solution of the second embodiment is represented by the above general formula (2), and functions as a complexing agent for metals less oxidizable than tin. After mixing α-thioglycerol as the...

no. 3 Embodiment approach ＞

[0083] The tin alloy plating solution of the third embodiment contains a soluble tin salt, a soluble salt of a metal less oxidizable than tin, and a sulfur compound represented by the general formula (3). This tin alloy plating solution may further contain additives.

[0084] The soluble tin salt contained in the tin alloy plating solution of the third embodiment, the soluble salt of a metal less oxidizable than tin, and the additive are the same as the soluble tin salt contained in the tin alloy plating solution of the first embodiment, and the soluble salt of a metal less oxidizable than tin. The metal soluble salts and additives are the same, so repeated explanations are omitted.

[0085] [Sulfur compound represented by general formula (3)]

[0086] The sulfur compound used in the tin alloy plating solution of the third embodiment is represented by the above general formula (3), and functions as a complexing agent for metals less oxidizable than tin. After mixing α-thiogl...

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Abstract

A tin alloy plating solution which contains a soluble tin salt, a soluble salt of a metal that is more noble than tin, and a sulfide compound that is represented by general formula (1). In general formula (1), (A) represents a hydrocarbon group having 1-2 carbon atoms and no oxygen atom, or alternatively, (A) represents a hydrocarbon group having 2-6 carbon atoms and one or more oxygen atoms. It is preferable that the metal that is more noble than tin is silver, copper, gold or bismuth.

Description

technical field [0001] The invention relates to a tin alloy plating solution for forming a tin alloy coating film by an electroplating method. More specifically, it relates to a tin alloy plating solution suitable for forming solder bumps for semiconductor wafers and printed circuit boards. [0002] This application claims priority based on Patent Application No. 2018-141146 filed in Japan on July 27, 2018 and Patent Application No. 2019-119213 filed in Japan on June 27, 2019, and the contents thereof are incorporated herein. Background technique [0003] It is known that in a tin alloy plating bath (liquid) for forming a tin alloy coating film on a conductive object, such as a tin-silver alloy coating film, there is a large difference in redox potential between tin ions and other metal ions (such as silver ions) in the bath. When it is too large, metal ions that are more difficult to oxidize than tin tend to form insoluble salts or metal monomers in the plating bath and pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/60C07C321/14C07C321/28
CPCC07C321/28C25D3/60C07C321/14C25D3/64C25D7/00
Inventor 巽康司
Owner MITSUBISHI MATERIALS CORP
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