Power assembly having a load-bearing cooling body

A power component and component technology, which is applied in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc. Effect

Pending Publication Date: 2021-01-15
MIBA ENERGY HLDG GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to install such a power module in a multilevel converter, a relatively complex frame structure is required to hold the individual components of the power module in order to be able to transfer the load to the frame of the multilevel current converter.
Furthermore, the disclosed structure has the disadvantage that the energy storage unit is arranged vertically on the semiconductor unit, thereby reducing the cooling effect of the cooling plate on the energy storage unit

Method used

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  • Power assembly having a load-bearing cooling body
  • Power assembly having a load-bearing cooling body
  • Power assembly having a load-bearing cooling body

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Embodiment Construction

[0056] First of all, it should be ensured that in the different described embodiments identical parts are provided with the same reference numerals or the same component designations, wherein the disclosure contained in the entire description can be transferred to the same reference numerals or the same component designations. on the same part of the name. The positional specifications selected in the description, such as top, bottom, side, etc., also refer to the directly described and shown figures, and these positional specifications are transferred to the new position in the event of a position change.

[0057] exist figure 1 An example of a medium-voltage or high-voltage converter 1 is shown in . Such a medium-voltage or high-voltage converter 1 has a housing 2 in which a plurality of receiving spaces 3 arranged one above the other are formed for receiving power components 4 in each case. A medium-voltage or high-voltage converter 1 may have a plurality of such racks 2 an...

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PUM

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Abstract

The invention relates to a power assembly (4) for a medium- or high-voltage converter (1), preferably a modular multi-level converter, comprising at least one power semiconductor assembly (7), preferably an IGBT assembly, at least one energy accumulator assembly (9), preferably a capacitor assembly, at least one cooling device (14), wherein the cooling device (14) is designed as a cooling plate (17) through which a coolant can flow, in particular a cooling fluid, and the at least one power semiconductor assembly (7) and/or the at least one energy accumulator assembly (9) are arranged on an upper (18) and/or underside (19) of the cooling plate (17), and wherein at least the power semiconductor assembly (7) is thermally conductively connected to the cooling plate (17), and wherein the cooling plate (17) is provided for load-bearing support on a frame (2) of an associated receiving space (3) of the medium- or high-voltage converter (1), and has protruding support surfaces (16) laterally in the transverse direction (11) in relation to at least one energy accumulator width (21) of the energy accumulator assembly (9).

Description

technical field [0001] The invention relates to a power assembly for a medium-voltage or high-voltage converter, preferably a modular multilevel converter, comprising a central cooling plate configured as a carrier element for receiving at least an energy storage assembly and a power semiconductor components. Background technique [0002] Modern medium-voltage or high-voltage converters usually have several interconnected power components for converting AC voltage to DC voltage and vice versa. Such power components can also be referred to as submodules, especially in modular multilevel converters. A person skilled in the art is aware of various possible arrangements of energy storage components, power semiconductor components, control devices connected thereto and, in particular, cooling devices provided for cooling these components. [0003] WO 2008 / 074274 A1 discloses a multilevel converter having a plurality of converter modules with power semiconductors and a plurality...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K7/14
CPCH05K7/20927H05K7/14325H05K7/1427H05K7/18H05K7/209H02B1/565
Inventor M·纳格尔米勒R·拉齐
Owner MIBA ENERGY HLDG GMBH
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