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Lead-free solder for sealing tempered vacuum glass in atmospheric environment and pressure brazing sealing method thereof

A lead-free solder, atmospheric environment technology, used in welding/cutting media/materials, welding equipment, welding media, etc., can solve problems such as low production efficiency, cumbersome sealing process, troublesome operation, etc. Mechanical properties, the effect of less components

Active Publication Date: 2022-04-08
HENAN POLYTECHNIC UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, most of the sealing process of tempered vacuum glass is carried out in a vacuum environment. The sealing process is cumbersome and takes too long. The operation is troublesome and the production efficiency is low.
The invention discloses a method for sealing tempered vacuum glass by pressurized brazing in an atmospheric environment, which overcomes the defects of high sealing temperature, complicated process and harsh sealing conditions in the traditional sealing method, and improves the Sealing quality and production efficiency of vacuum glass

Method used

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  • Lead-free solder for sealing tempered vacuum glass in atmospheric environment and pressure brazing sealing method thereof
  • Lead-free solder for sealing tempered vacuum glass in atmospheric environment and pressure brazing sealing method thereof
  • Lead-free solder for sealing tempered vacuum glass in atmospheric environment and pressure brazing sealing method thereof

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Effect test

Embodiment 1

[0035] A lead-free solder for sealing tempered vacuum glass in an atmospheric environment and a pressurized brazing sealing method thereof, specifically comprising the following steps:

[0036] (1) Lead-free solder ingredients

[0037] In the lead-free solder, In accounts for 5.0% by weight of the solder, Ag accounts for 1.0% by weight of the solder, Ga accounts for 1.5% by weight of the solder, the rest is Sn, and the unavoidable impurity content is less than 0.2%. The raw materials of the components are all granular, with a purity of 99.99%.

[0038] (2) Preparation of lead-free solder

[0039] According to the weight ratio of Sn:In, Sn:Ag and Sn:Ga 1:1, weigh the raw materials respectively and place them in the crucible of the vacuum induction melting furnace. After vacuuming, fill it with argon for melting. The melting temperature is 500℃~600℃ , the smelting time is 20min~30min, the vacuum degree is 10-4Pa, and the magnetic force is continuously added to stir during the ...

Embodiment 2

[0044] A lead-free solder for sealing tempered vacuum glass in an atmospheric environment and a pressurized brazing sealing method thereof, specifically comprising the following steps:

[0045] (1) Lead-free solder ingredients

[0046] In the lead-free solder, In accounts for 5.0% by weight of the solder, Ag accounts for 4.0% by weight of the solder, Ga accounts for 0.05% by weight of the solder, the rest is Sn, and the unavoidable impurity content is less than 0.2%. The raw materials of the components are all granular, with a purity of 99.99%.

[0047] (2) Preparation of lead-free solder

[0048] According to the weight ratio of Sn:In, Sn:Ag and Sn:Ga 1:1, weigh the raw materials respectively and place them in the crucible of the vacuum induction melting furnace. After vacuuming, fill it with argon for melting. The melting temperature is 500℃~600℃ , the smelting time is 20min~30min, the vacuum degree is 10-4Pa, and the magnetic force is continuously added to stir during the...

Embodiment 3

[0053] A lead-free solder for sealing tempered vacuum glass in an atmospheric environment and a pressurized brazing sealing method thereof, specifically comprising the following steps:

[0054] (1) Lead-free solder ingredients

[0055] In the lead-free solder, In accounts for 5.0% by weight of the solder, Ag accounts for 2.5% by weight of the solder, Ga accounts for 1.0% by weight of the solder, the rest is Sn, and the unavoidable impurity content is less than 0.2%. The raw materials of the components are all granular, with a purity of 99.99%.

[0056] (2) Preparation of lead-free solder

[0057] According to the weight ratio of Sn:In, Sn:Ag and Sn:Ga 1:1, weigh the raw materials respectively and place them in the crucible of the vacuum induction melting furnace. After vacuuming, fill it with argon for melting. The melting temperature is 500℃~600℃ , the smelting time is 20min~30min, the vacuum degree is 10-4Pa, and the magnetic force is continuously added to stir during the ...

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Abstract

The invention relates to a lead-free solder used for sealing toughened vacuum glass in an atmospheric environment and a pressurized brazing sealing method thereof. The toughened vacuum glass is prefabricated with a metal layer in a region to be sealed. In the lead-free solder, In accounts for 5.0%-15.0% by weight of the solder, Ag accounts for 0.5%-5.0% by weight of the solder, Ga accounts for 0.05%-2.0% by weight of the solder, and the rest is Sn, an unavoidable impurity The content is less than 0.2%. The solder contains few components, has a low melting temperature and good wettability, and meets the requirements for low-temperature sealing of tempered vacuum glass. At the same time, the pressurized brazing technology is used for sealing in the atmospheric environment. The solder can form a good sealing joint with the prefabricated tempered glass substrate with a metal layer, which meets the production and use requirements. The invention overcomes the defects of high sealing temperature, complicated process and harsh sealing conditions in the traditional sealing method, improves the sealing quality and production efficiency of the tempered vacuum glass, and is suitable for popularization and application.

Description

technical field [0001] The invention relates to the field of tempered vacuum glass sealing, in particular to a lead-free solder used for sealing tempered vacuum glass in an atmospheric environment and a pressurized brazing sealing method thereof. Background technique [0002] Vacuum glass is a new generation of green and environmentally friendly building materials that meet energy-saving requirements and reduce building energy consumption. In recent years, the research on vacuum glass has been increasing day by day, and more and more researchers have turned their attention to the field of vacuum glass sealing. At present, vacuum glass sealing materials mainly include inorganic non-metallic materials, metal materials and organic polymer materials. Nowadays, most of the large-scale production of vacuum glass in enterprises uses low melting point glass powder and metal solder, and only a few patents mention the application of organic polymer materials in vacuum glass sealing. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40C03C27/08
CPCB23K35/262B23K35/40C03C27/08
Inventor 徐冬霞曹福磊杨毅博褚亚东任鹏凯李子昂李彦兵张红霞
Owner HENAN POLYTECHNIC UNIV
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