Continuous vacuum magnetron sputtering coating device and coating production line

Abstract

The invention discloses a continuous vacuum magnetron sputtering coating device and a coating production line. The continuous vacuum magnetron sputtering coating device comprises an alternate coatingunit and a variable-speed rotating unit, a first sputtering target and a second sputtering target which are opposite to each other are movably arranged between a positive electrode power connection annular plate and a negative electrode power connection annular plate, and gear teeth of a first driven rotating gear and gear teeth of a second driven rotating gear are complementary; and a plurality of variable-speed rotating wheels with different sizes are fixedly connected to a driving rotating rod, empty grooves are formed in the two sides of an adjusting rod, and adjusting mechanisms are fixedly arranged in the empty grooves. When the continuous vacuum magnetron sputtering coating device is used, the positive electrode power connection annular plate and the negative electrode power connection annular plate are arranged, so that the two sides of a part to be coated are alternately coated, and positive ions accumulated on a target surface are neutralized; and through the arrangement of the multiple variable-speed rotating wheels with the different sizes, multiple second driving rotating gears and the adjusting mechanisms, the coating thicknesses of the two sides of the part to be coated are different, different process requirements are met, and the application range of the device is widened.

Description

technical field [0001] The invention relates to the technical field of sputtering coating equipment, in particular to a continuous vacuum magnetron sputtering coating device and a coating production line. Background technique [0002] At present, magnetron sputtering coating technology is a widely used vacuum coating technology method, which is widely used in optics, microelectronics decoration and other industrial fields to provide reliable and stable thin film coatings. However, the existing magnetron sputtering devices still have many defects, such as lack of multi-face coating capability. [0003] In the prior art, a magnetron sputtering device with the application number "201210516126.5" for coating the surface of flexible wires includes a loading chamber, a magnetron sputtering coating chamber and a winding chamber. In the magnetron sputtering coating chamber At least three sputtering targets are evenly distributed in a ring, and multiple sputtering targets are simult...

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Problems solved by technology

[0004] However, there are still many defects in the existing technology, such as: the sputtering target receives positive charges for a long time, so that the accumulation of cations on the sputtering target is too much, which is easy to cause the phenomenon of sparking between electrodes, resulting in defects in the film and reducing the coating accuracy

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