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Test machine matching system and matching method thereof

A matching method, testing machine technology, applied in electronic circuit testing, semiconductor/solid-state device testing/measurement, electrical measurement, etc.

Active Publication Date: 2021-01-22
上海伟测半导体科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the test factory receives the test order from the wafer manufacturer, it is often impossible to directly judge that the testing machine it has can cover the wafer test items required by the wafer manufacturer.

Method used

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  • Test machine matching system and matching method thereof
  • Test machine matching system and matching method thereof
  • Test machine matching system and matching method thereof

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Embodiment Construction

[0036] The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0037] Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention and The above terms should not be construed as limiting the present invention because the description is simplified rather than indicatin...

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Abstract

The invention relates to a test machine matching system and a matching method thereof. The matching method comprises the following steps: (1) setting configuration information capable of collecting atest machine and test item related information of a wafer to be tested; (2) automatically receiving configuration information of the test machine acquired through acquisition, and transcribing the configuration information to a comparison template defined by a template related to a wafer test item recorded by a wafer manufacturer; (S3) comparing the test item related information of the wafer to betested with the information transcribed in the comparison template; and (S4) outputting a comparison result. Through the test machine matching system, an operator can use the corresponding recommended test machine to detect the wafer to be tested in time.

Description

technical field [0001] The invention relates to the detection system field of a wafer testing machine, in particular to a testing machine matching system and a matching method thereof. Background technique [0002] At present, the integrated circuit manufacturing process is changing with each passing day. The diameter of the wafer reaches 300mm, the line of the die reaches 60nm or even finer, and the chip area is smaller. More than 10,000 dies can be produced on a wafer; the test of the dies is completed by the timely and close cooperation of the test system and the probe station (Prober). [0003] The performance of all dies is tested and analyzed by a wafer testing machine to detect failed dies, qualified dies, or dies that need to be repaired. Existing, common testing machines include J750 testing machine and Advantest 93K testing machine. The configuration of J750 testing machine is often relatively high, and its detection efficiency and detection accuracy are also rel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28H01L21/66
CPCG01R31/2851H01L22/10
Inventor 傅郁晓吴庆骈文胜闻国涛杨恭乾
Owner 上海伟测半导体科技股份有限公司