Metal plating mechanism based on electroplating mode

Abstract

The invention relates to the technical field of metal plating, and discloses a metal plating mechanism based on an electroplating mode. The metal plating mechanism comprises a shell, a positioning frame is fixedly mounted on the left wall of an inner cavity of the shell, an elastic rod is slidably connected to the inner cavity of the positioning frame, and a wedge block is fixedly connected to theright end of the elastic rod. An air bag set is fixedly installed on the left wall of the inner cavity of the positioning frame, an air storage groove is formed in the left portion of the positioningframe, and an elastic piston is slidably connected to the right portion of the inner cavity of the air storage groove. According to the metal plating mechanism based on the electroplating mode, a rotating crank, a guide handle and a curved connecting frame are matched to enable a reinforcing shaft to reciprocate up and down, a spherical connecting rod, a sliding block and a rotating cylinder arematched to enable the reinforcing shaft to rotate, bubbles on the surface of plated metal can be broken through the two combined movement modes, and therefore, the metal plating quality is effectivelyimproved, and a user can conveniently and safely extract the plated metal.

Description

technical field [0001] The invention relates to the technical field of metal plating, in particular to a metal plating mechanism based on electroplating. Background technique [0002] The plating of metal materials is the process of plating a thin layer of other metals or alloys on some metal surfaces to play the role of anti-oxidation, improve wear resistance, electrical conductivity, corrosion resistance, etc. During the use of the metal plating mechanism performed by electroplating, after the metal to be plated enters the electrolyte from the air, air bubbles or water films will naturally occur on the surface of the metal, and these air-carrying air bubbles or water films cannot be automatically removed. Cracks, which in turn will cause some areas of the metal surface to be unable to be plated, and ultimately affect the plating quality of the metal. In addition, after the metal plating is completed, it is necessary to manually use tools to remove the plated metal parts in...

AI Technical Summary

Problems solved by technology

[0002] The plating of metal materials is the process of plating a thin layer of other metals or alloys on some metal surfaces to play the role of anti-oxidation, improve wear resistance, electrical conductivity, corrosion resistance, etc. During the use of the metal plating mechanism performed by electroplating, after the metal to be plated enters the electrolyte from the air, air bubbles or water films will naturally occur on the surface of the metal, and these air-carrying air bubbles or water films cannot be automatically removed. Cracks, which in turn will cause some areas of the metal surface to be unable to be plated, and ultimately affect the plating quality of the metal. In addition, after the metal plating is completed, it is necessary to manually use tools to remove the plated metal parts in the electrolyte, and tools are used on the way It is easy to accidentally drop into the electrolytic tank, and the user's skin is also easy to come into contact with the electrolyte, which poses a certain safety hazard

[0003] Aiming at the deficiencies of the prior art, the present invention provides a metal plating mechanism based on electroplating, which has the advantages of effectively improving the quality of metal plating and allowing users to conveniently and safely extract the metal after plating. It solves the problem that the general metal plating mechanism based on the electroplating method has average plating quality and it is inconvenient for users to extract the metal after plating.

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