Drying device of polycrystalline silicon wafer cleaning and texturing machine

Abstract

The invention discloses a drying device of a polycrystalline silicon wafer cleaning and texturing machine. The drying device comprises a box body, wherein a box door is arranged on the box body; an air outlet is formed in the top of the box body; a partition plate is arranged in an inner cavity of the box body; the inner cavity of the box body is divided into two layers by the partition plate; edges of the partition plate are fixedly connected with an inner cavity wall of the box body; a heating device is arranged below the partition plate; a mounting device is arranged above the partition plate; a metal pipe is further arranged below the partition plate; one end of the metal pipe penetrates through a side wall of the box body and extends out of the box body; one end, extending out of thebox body, of the metal pipe is fixedly connected with an output end of an air pump; one end, far away from the air pump, of the metal pipe penetrates through the partition plate and extends above thepartition plate; and a hose sleeves one end, far away from the air pump, of the metal pipe. The drying device of the polycrystalline silicon wafer cleaning and texturing machine is large in single processing capacity, the cost is reduced, and the enterprise benefit is improved; and meanwhile, multi-angle drying can be achieved, the time is saved, the device is simple in structure, an operator is convenient to learn, and the demand of an enterprise is met.

Description

technical field [0001] The invention relates to the technical field of semiconductor material processing, in particular to a polycrystalline silicon wafer cleaning and texturing machine drying device. Background technique [0002] At present, silicon materials are widely used in daily life, and the production volume of silicon wafers is also increasing day by day. After a series of processing procedures, silicon wafers need to be cleaned and textured. The purpose of cleaning is to eliminate various particles adsorbed on the surface of silicon wafers. Texture making is to make a suede structure on the surface to reduce sunlight emission, and the degree of cleaning directly affects the yield. Silicon wafer cleaning machines are often equipped with a large number of slots, which are not easy to clean, pollutants will cause corrosion to the transmission mechanism, and the moisture in the slots is difficult to dry. [0003] To sum up, the problems existing in the prior art are: ...

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Problems solved by technology

[0003] To sum up, the problems existing in the prior art are: the drying method of the polysilicon wafer cleaning and texturing machine needs to consume a large amount of nitrogen, not only the equipment cost is expensive, but also the production cost of the enterprise is high, and it is difficult to obtain benefits. The drying method in the past often cannot Dries thoroughly, causing moisture residue

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