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Ceramic Electronic Components

A technology of electronic components and ceramics, applied in the field of ceramic electronic components, can solve problems such as unsatisfactory thermal shock resistance or high temperature load life

Active Publication Date: 2022-02-15
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the technique of Patent Document 1, when a more severe thermal load of about 200°C is applied, there is a possibility that the thermal shock resistance and the high-temperature load life cannot be satisfied.

Method used

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  • Ceramic Electronic Components
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0130] Hereinafter, the present invention will be described based on more detailed examples, but the present invention is not limited to these examples.

[0131] (Experiment 1)

[0132] In Experiment 1, capacitor samples according to Examples 1 to 20 were fabricated. As the ceramic body 10 of each capacitor sample, CaZrO laminated with CaZrO 3 A sintered body sample of the ceramic layer 2 as the main component and the internal electrode layer 3 containing Ni. Then, with respect to this sintered body sample, a pair of external electrodes 4 were formed in the following procedure.

[0133] First, a metal paste to be a raw material of the base electrode layer 40 is prepared. This metal paste is obtained by preparing and kneading a metal powder, a glass component, and a vehicle at a predetermined ratio. The glass components used at this time use ZnO, B 2 o 3 , SiO 2 、Al 2 o 3 As a raw material, additionally, a mixture selected from BaCO 3 , CaCO 3 , SrCO 3 , MgCO 3 , o...

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Abstract

The invention relates to a ceramic electronic component, which has: a ceramic body, which is formed by alternately stacking ceramic layers and internal electrode layers; and an end face electrode, which is formed on the end face of the ceramic body. The end face electrode has: a base electrode layer including a metal component and a glass component; an intermediate electrode layer formed outside the base electrode layer and containing Ni; an upper electrode layer further formed outside the intermediate electrode layer and containing Pd or Au. In addition, in the end surface electrodes, the surface roughness Ra1 of the base electrode layer is 5 μm or less. Alternatively, in the end electrode, the relationship between the surface roughness Ra1 of the base electrode layer, the surface roughness Ra2 of the intermediate electrode layer, and the surface roughness Ra3 of the upper electrode layer is Ra1>Ra3≥Ra2.

Description

technical field [0001] The present invention relates to a ceramic electronic component formed with external electrodes. Background technique [0002] Electronic components such as a plurality of ceramic electronic components are mounted inside the electronic equipment. [0003] Currently, in the mounting of these electronic components, lead-free solders such as Sn-Ag-Cu based solders, conductive adhesives in which conductive fine particles such as metal fillers are added to thermosetting resins such as epoxy resins, etc. are used as bonding materials. . The selection of these bonding materials is mainly determined by the use environment. [0004] In recent years, in inverter circuits and the like using SiC power semiconductors, the operating environment is assumed to exceed 150°C. Therefore, in such a circuit board, a mounting technique capable of maintaining a stable bonding force (that is, high mounting reliability) is required even when a thermal load is applied. To m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/232H01G4/30H01G4/12
CPCH01G4/232H01G4/2325H01G4/30H01G4/12
Inventor 高桥哲弘福冈智久
Owner TDK CORPARATION
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