A kind of manufacturing method of heating substrate for thin film thermal print head

Abstract

The invention belongs to the technical field of thermal print head manufacturing, and in particular relates to a manufacturing method of a heating substrate for a thin film thermal print head. In the manufacturing method provided by the present invention, the insulating protective layer is arranged in two steps. After the setting of the first insulating protective layer is completed, the foreign matter on the surface of the first insulating protective layer in the area above the heating resistor is ground and removed, and the defects after the foreign matter removal are removed by the second insulating protective layer. The insulating layer is shielded; in the area other than the heating resistor, an organic silicon potential shielding layer is set between the first insulating protective layer and the second insulating protective layer, so the insulating effect of the second insulating layer on the organic silicon potential shielding layer is not effective. In this way, the insulating effect of the second insulating layer can be guaranteed, and the electrochemical corrosion problem of the conductive protective layer on the second insulating layer can be effectively avoided. The manufacturing method provided by the present invention solves the problem of electrochemical corrosion of the conductive protective layer by adopting the combination of the organic silicon shielding layer and the grinding means.

Description

technical field [0001] The invention belongs to the technical field of thermal print head manufacturing, and in particular relates to a manufacturing method of a heating substrate for a thin film thermal print head. Background technique [0002] The heating substrate for thin film thermal print head includes an insulating substrate with an amorphous glaze coating formed on the surface, a heating resistor layer is arranged on the amorphous glaze coating, and a conductor layer covering the heating resistor layer is formed. By photolithography technology, the conductor layer is formed into electrode wires, and the resistor layer is formed into several heating resistors arranged along the main printing direction, and then non-conductive materials are used, and the heating resistors and at least part of the heating resistors are formed by sputtering. An insulating protective layer is formed on the electrode wires. In order to prevent static electricity generated by the friction b...

AI Technical Summary

Problems solved by technology

[0005] However, there are many problems in the scheme of JPA 2000079715. The thermal print head is installed in the printer and sold to the end consumer. The ionic charge in different printing media used by different end consumers may be opposite. Different printing media may be used, and it is difficult to implement different access schemes using conductive protective films according to the different electrical properties of ions in the printing media

In addition, even if the conductive protective film can be grounded or connected to a high potential according to the electrical difference of ions in the printing medium, it may be possible to prevent the ions in the printing medium from invading and corroding the electrodes. However, because the resistivity of the conductive protective film is usually lower than that of the electrodes The resistivity of the wire material is about 10,000 times. When there is a defect in the insulating protective film, there will still be a potential difference in the conductive protective film between the defect area and the potential access point, unless the defect area and the potential access point are at the same position, so , in a humid environment, the conductive protective film will still be damaged by electrochemical corrosion

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