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Preparation method of ETFE release film for IC chip

A release film and chip technology, which is applied in the direction of film/sheet adhesive, film/sheet release liner, electrical components, etc., can solve the problems of ETFE release film overall performance decline and other issues

Inactive Publication Date: 2021-02-02
银金达(上海)新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing ETFE release film preparation process is mostly produced by single extrusion film formation. This method makes the functional additives in the same layer of film, and the overall performance of the ETFE release film decreases due to different material properties. possibility

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A kind of preparation method for the ETFE release film of IC chip, comprises the following steps:

[0027] (1) Get the ETFE resin that is 100:4:3:5 in mass ratio, cross-linking agent, antioxidant and toughening agent mix and add the inner layer of three-layer co-extrusion type extruder, get mass ratio as 100: The 4:3:5 ETFE resin, crosslinking agent, antioxidant and adhesive are mixed with the middle layer of the three-layer co-extrusion extruder, and the mass ratio of ETFE is 100:4:3:5:2 Resin, crosslinking agent, antioxidant, polyethylene wax particles and antistatic agent are added to the outer layer of the 3-layer co-extrusion extruder, and the temperature is raised to melt and extrude the material;

[0028] (2) After laminating the melt-extruded materials through the machine head, the three-layer co-extrusion method is used to melt and extrude through the T-shaped die head. The melt extrusion temperature is 240-280 ° C, and the screw size of the extruder is φ= 20-...

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PUM

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Abstract

The invention belongs to the field of release films, and discloses a preparation method of an ETFE release film for an IC chip. The method comprises the following steps of: (1) uniformly mixing ETFE resin, a cross-linking agent, an antioxidant and a toughening agent in a mass ratio of 100:4:3:5, adding the mixture into the inner layer of a three-layer co-extrusion extruder, taking ETFE resin, a cross-linking agent, an antioxidant and an adhesive according to a mass ratio of 100:4:3:5, uniformly mixing the substances, and adding the mixture into the middle layer of the three-layer co-extrusionextruder. ETFE resin is used as a main raw material and subjected to multi-layer melt co-extrusion in a processing mode to be compounded into the ETFE release film, the comprehensive performance of the ETFE resin film is guaranteed to the maximum extent, and the ETFE release film has the functions of high temperature resistance, abrasion resistance, static electricity resistance and the like, canbe pressed at 250DEG C, has high release performance, and compared with single extrusion film forming, the processing mode avoids the possibility that the overall performance of the ETFE resin film isreduced due to different material performances of the functional additives in the same layer of film.

Description

technical field [0001] The invention relates to the technical field of release films, in particular to a method for preparing an ETFE release film used for IC chips. Background technique [0002] ETFE release film can also be called ethylene-chlorotetrafluoroethylene copolymer, also known as ETFE release film, ETFE release film, ETFE isolation film, ETFE separation film, ETFE barrier film, etc., mainly used for flexible circuit boards and For high-power LED production and electronic products, such as IC chip production, the film has a very good effect of isolating glue and does not stick to any glue; [0003] However, the existing ETFE release film preparation process is mostly made by single extrusion film formation. This method makes the functional additives in the same layer of film, and the overall performance of the ETFE release film decreases due to different material properties. possibility. Contents of the invention [0004] (1) Solved technical problems [0005...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L23/08C08L23/06C08L67/00C08L71/12C08L81/06C08K13/02C08K3/04C08K5/5419C08K5/544C08K5/5425C09J7/40B29C48/00B29C48/08B29C48/18H01L33/00
CPCB29C48/022B29C48/08B29C48/18C08J5/18C08J2323/08C08J2423/06C08J2423/08C08J2467/00C08J2471/12C08J2481/06C08K3/04C08K5/5419C08K5/5425C08K5/544C08K13/02C08K2201/017C09J2203/326C09J7/403H01L33/00
Inventor 王翔宇宋厚春欧雪光陈洪
Owner 银金达(上海)新材料有限公司
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