Semiconductor refrigeration and heating cycle box structure and manufacturing method thereof

Abstract

The invention discloses a semiconductor refrigeration and heating cycle box structure. The semiconductor refrigeration and heating cycle box structure is characterized in that three sets of flow guideunit bodies are arranged in a box body, and three straight holes are formed in each flow guide unit body; inner covers are fixed at the front end and the rear end of the box body, and outer covers are fixed at the outer ends of the inner covers; and flow dividing structures are arranged on the adjacent sides of the inner covers and the outer covers. A method for manufacturing the outer box structure comprises the following steps of a, manufacturing the box body; b, manufacturing the inner covers; c, manufacturing the outer covers; and d, manufacturing a fixing structure. According to the semiconductor refrigeration and heating cycle box structure and the manufacturing method thereof, the improvement is ingenious, the inner covers and the outer covers are designed in end covers, through holes and notches are formed in the inner covers, after the inner covers and the box body are fixed, the notches can play a role in steering, the machining is convenient, the size can be accurately controlled, the through holes are formed in the outer covers, and flow dividing channels are collected to carry out centralized flow guiding; and all pipelines are simple, rapid and convenient in connection.

Description

technical field [0001] The invention relates to a semiconductor cooling and heating cycle box structure and a manufacturing method thereof. Background technique [0002] The invention is applied to derivative products improved by the characteristics of semiconductor heating and heating, such as semiconductor air conditioners and semiconductor temperature-controlled beds. In the traditional structure, due to the limited heat transfer capacity of the circulation box, it is necessary to improve its heat transfer efficiency. The method for prolonging the channel of the refrigerant fluid, for example, the application number: 201110462868.X, discloses "A Manufacturing Method for the External Heat Exchanger of a Semiconductor Refrigeration Heater", which is designed to be S-shaped path to increase the heat exchange efficiency of the outer box. This processing method is simple, but it needs to be sealed with an anti-rust plug. Due to multi-point plugging, the probability of leakage ...

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Problems solved by technology

[0002] The invention is applied to derivative products improved by the characteristics of semiconductor heating and heating, such as semiconductor air conditioners and semiconductor temperature-controlled beds. In the traditional structure, due to the limited heat transfer capacity of the circulation box, it is necessary to improve its heat transfer efficiency. The method for prolonging the channel of the refrigerant fluid, for example, the application number: 201110462868.X, discloses "A Manufacturing Method for the External Heat Exchanger of a Semiconductor Refrigeration Heater", which is designed to be S-shaped path to increase the heat exchange efficiency of the outer box. This processing method is simple, but it needs to be sealed with an anti-rust plug. Due to multi-point plugging, the probability of leakage at the leak point increases, because the plugging direction is closed by the heat insulation layer. , if there is a leak and cannot be effectively repaired, it will cause a fatal performance hazard. The size of the plug stuck in the drill hole cannot be accurately controlled, resulting in different sizes of the S-shaped path at the steering position, which affects the local fluid flow rate and further affects the heat transfer effect. , based on independent exploration and improvement, the company hereby applies for this invention

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