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Heat dissipation integrated solid-state relay

A technology of solid-state relays and heat sinks, applied in relay ventilation/cooling/heating, electrical components, electronic switches, etc., can solve troubles and other problems, achieve the effects of reducing movement, convenient and quick assembly, and reducing glue leakage

Pending Publication Date: 2021-02-02
江苏固特电气控制技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned related technologies, the inventor believes that the above-mentioned patent needs to install the solid-state relay on the heat dissipation structure after the solid-state relay is assembled, which is troublesome.

Method used

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  • Heat dissipation integrated solid-state relay
  • Heat dissipation integrated solid-state relay
  • Heat dissipation integrated solid-state relay

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] like figure 1 and figure 2 As shown, a heat dissipation integrated solid-state relay includes a circuit board 1 and a silicon controlled rectifier 2. Both the silicon controlled rectifier 2 and the circuit board 1 are provided with conductive pins 12, and the silicon controlled rectifier 2 is connected with three pins. 12. There are four pins 12 connected to the circuit board 1. The side of the circuit board 1 far away from the pins 12 on itself is connected with an indicator light 13, and the circuit board 1 is provided with a pin 12 on the thyristor 2. The provided energizing slot 11, the circuit board 1 and the thyristor 2 form the basic circuit of the relay.

[0044] like figure 2 and image 3 As shown, the solid-state relay in this embodiment also includes a cooling plate 3, a heat sink 4 and an enclosure 5. The heat sink 4 includes a first piece 41 and a second piece 42, and the first piece 41 is arranged and fixedly connected to the heat dissipation support ...

Embodiment 2

[0057] like Image 6 and Figure 7 As shown, a heat dissipation integrated solid state relay, the difference between the second embodiment and the first embodiment is that the heat dissipation support plate 3 is located on the side wall of the opening end of the installation cavity 31 and is fixedly connected with a positioning piece 8, and the positioning piece 8 is located on the In the middle of the two installation substrates 61, the positioning piece 8 is perpendicular to the heat dissipation support plate 3; the end of the cover plate 51 away from the baffle plate 53 is provided with a matching through groove 511, and the side of the cover plate 51 away from the heat dissipation support plate 3 is fixedly connected with a tension block 81. After the enclosure 5 slides onto the cooling support plate 3, the positioning piece 8 is inserted on the groove wall of the matching through groove 511, and the positioning piece 8 is opposite to the tensioning block 81.

[0058] lik...

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PUM

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Abstract

The invention relates to a heat dissipation integrated solid-state relay, and relates to the field of solid-state relays. The solid-state relay comprises a circuit board and a silicon controlled rectifier, and also comprises a heat dissipation supporting plate, heat dissipation fins and a surrounding cover, wherein the heat dissipation fins are arranged on the heat dissipation supporting plate, the surrounding cover is arranged on the heat dissipation supporting plate through a connecting piece, the side wall of the surrounding cover and the side wall of the heat dissipation supporting plate form an installation cavity, the silicon controlled rectifier is located in the installation cavity and connected with the heat dissipation supporting plate, and the circuit board is arranged on the heat dissipation supporting plate and located in the installation cavity. According to the invention, the heat dissipation structure, the silicon controlled rectifier of the relay and the circuit boardare integrally arranged, and assembling is more convenient and faster.

Description

technical field [0001] The present application relates to the field of solid-state relays, in particular to a heat dissipation integrated solid-state relay. Background technique [0002] The solid-state relay is a non-contact switch composed of microelectronic circuits, discrete electronic indicator lights, and power electronic power indicators; it is a four-terminal indicator light with two terminals as input terminals and the other two terminals as output terminals. The isolation indicator light is used to realize the electrical isolation of the input and output, and the input terminal of the solid state relay uses a small control signal to directly drive a large current load. [0003] The Chinese patent with the publication number CN205508717U discloses a heat dissipation structure of a solid state relay, a solid state relay device and a metal bath; the heat dissipation structure of a solid state relay includes a bottom plate, a first side plate and a second side plate, t...

Claims

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Application Information

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IPC IPC(8): H01H45/12H01H45/02H03K17/00
CPCH01H45/12H01H45/02H03K17/00
Inventor 殷晨钟季卫东殷孜
Owner 江苏固特电气控制技术有限公司