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Variable resistance memory and manufacturing method thereof

A manufacturing method and resistive technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of reducing the reliability of variable resistive memory, difficult formation and breakage control of conductive wires, etc., and achieve good repeated reading and writing ability. , to avoid the formation of multiple conductive filaments, the effect of reducing the voltage

Pending Publication Date: 2021-02-02
WINBOND ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, during the operation of the variable resistive memory, since the conductive thread is quite sensitive to the surrounding environment, it is difficult to control the formation and breakage of the conductive thread, which reduces the reliability of the variable resistive memory, such as the ability to read and write repeatedly. (endurance) and memory retention (retention)

Method used

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  • Variable resistance memory and manufacturing method thereof
  • Variable resistance memory and manufacturing method thereof
  • Variable resistance memory and manufacturing method thereof

Examples

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Embodiment Construction

[0055] see figure 1 As shown, the variable resistance memory 10 includes a substrate 12 , a bottom electrode 14 , a metal oxide layer 16 , and a plurality of top electrodes 18 . A plurality of vias are formed in the substrate 12 and filled with a conductive material 22 . Conductive material 22 may include, for example, tungsten or copper. A via liner 24 is further formed between the sidewall of the via hole and the conductive material 22 . The via liner 24 may be composed of multi-layer material layers such as TaN / Ta or Ti / TiN. The bottom electrode 14 is formed on the substrate 12 and is electrically connected to the conductive material 22 in the substrate 12 . The bottom electrode 14 is a continuous bottom electrode, that is, the bottom electrode 14 is completely formed on the substrate 12 . The metal oxide layer 16 is formed on the bottom electrode 14 and is a continuous metal oxide layer, that is, the metal oxide layer 16 is formed on the bottom electrode 14 completely....

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Abstract

The invention provides a variable resistance memory and a manufacturing method thereof. The variable resistance memory comprises a lower electrode, a metal oxide layer and a plurality of upper electrodes, wherein the metal oxide layer is formed on the lower electrode, the metal oxide layer comprises a plurality of conductive wire areas, each conductive wire area is provided with a bottom and a top, the width of the bottom is greater than that of the top, each conductive wire area comprises an oxygen vacancy, and the region, except the conductive wire region, in the metal oxide layer is a nitrogen-containing region; and the plurality of upper electrodes are formed on the metal oxide layer and respectively correspond to the conductive wire areas.

Description

technical field [0001] The invention relates to a variable resistance memory, in particular to a variable resistance memory capable of enhancing local electric field. Background technique [0002] Resistive random access memories (RRAM) have the advantages of fast instruction cycle and low power consumption, and are ideal for the next generation of non-volatile memory. The variable resistance memory is provided with a transition metal oxide (transition metal oxide, TMO) layer between two metal electrodes, which controls the state of the conductive filament in the transition metal oxide layer to be in the high resistance state (HRS) and low Electrically switch between resistance states (LRS). [0003] However, during the operation of the variable resistive memory, since the conductive thread is quite sensitive to the surrounding environment, it is difficult to control the formation and breakage of the conductive thread, which reduces the reliability of the variable resistive...

Claims

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Application Information

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IPC IPC(8): H01L45/00H01L27/24
CPCH10B63/00H10N70/20H10N70/011
Inventor 白昌宗林铭哲刘奇青赵鹤轩郑嘉文
Owner WINBOND ELECTRONICS CORP
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