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Packaging structure of time-of-flight distance sensor

A distance sensor and time-of-flight technology, applied in the field of sensors, can solve problems such as complex packaging structures, and achieve the effects of accurate measurement structures, cost reduction, and simple structures

Inactive Publication Date: 2021-02-05
VISIONICS MICROELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcomings of the prior art that the packaging structure is relatively complicated, and the reference detector and the measurement detector are usually not strictly separated, and propose a packaging structure of a time-of-flight distance sensor

Method used

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on the other component or t...

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Abstract

The invention discloses a packaging structure of a time-of-flight distance sensor. The packaging structure comprises a substrate and a top cover, a chip is bonded on the outer wall of the top of the substrate, a reference detector and a measurement detector are respectively integrated on the two sides of the outer wall of the top of the chip, and a laser is bonded on the side, close to the reference detector, of the outer wall of the top of the substrate. First opaque glue is arranged at the position, close to the edge, of the outer wall of the top of the substrate, the top cover is adhered tothe outer wall of the top of the substrate through the first opaque glue, a baffle is integrally formed on the outer wall of the bottom of the top cover, second opaque glue is adhered to the outer wall of the bottom of the baffle, and the baffle is adhered to the upper face and the two sides of the chip through the second opaque glue. A light outlet and a light inlet are formed in the two sides of the outer wall of the top of the top cover respectively, and optical filters are bonded to the positions, close to the light outlet and the light inlet, of the inner wall of the bottom of the top cover. The packaging structure is simple, and the packaging operation can be completed only by using opaque glue with lower cost, so that the cost of the device is reduced.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a package structure of a time-of-flight distance sensor. Background technique [0002] TOF is the abbreviation of Time of Flight (Time of Flight), that is, the sensor emits near-infrared light and reflects it when it encounters an object. The sensor converts the distance of the scene to be photographed by calculating the time difference or phase difference between light emission and reflection to generate depth information. Combined with traditional camera shooting, the three-dimensional outline of the object can be presented in the form of topographic maps with different colors representing different distances. Whether it is autonomous driving, robots or the endless balance cars on the market, TOF technology is inseparable. [0003] The packaging structure of the existing time-of-flight distance sensors is relatively complicated, and the reference detector and the measurement d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01S7/481G01S7/4865G01S7/4915H01L23/31H01L25/16
CPCG01S7/481G01S7/4865G01S7/4915H01L23/3107H01L25/167
Inventor 张星星刘高黄晓林俞坤治李成陈志远
Owner VISIONICS MICROELECTRONICS TECH CO LTD
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