Manufacturing method of filter assembly, camera module and manufacturing method thereof

Abstract

The invention discloses a manufacturing method of an optical filter assembly, a packaging method of a camera module and a camera module. The method includes: providing filter glass, forming a plurality of brackets on the first surface of the filter glass, each bracket including an opposite annular first end surface and a second end surface, and a side portion perpendicular to the first end surface is arranged between the end surfaces, and the first end surface is perpendicular to the first end surface. One end face is bonded with the first surface of the filter glass to form a groove with the filter glass; the filter glass is cut to form a plurality of filter components. The camera module includes: a substrate; a photosensitive element, which is arranged on the substrate and is electrically connected to the substrate; a filter assembly, wherein the end of the bracket away from the filter is arranged on the substrate, wherein the filter, the bracket and the substrate form a closed space The photosensitive element is located in the cavity; the lens and the motor are arranged above the filter. The present invention reduces the process of manufacturing the camera module and reduces the manufacturing cost by forming the filter assembly with the integrated structure of the bracket and the filter in batches.

Description

technical field [0001] The invention relates to the field of camera manufacturing, and more particularly, to a manufacturing method of a filter assembly, a camera module and a manufacturing method thereof. Background technique [0002] like figure 1 As shown, the filter 101 and the bracket 102 (base) in the existing terminal camera are manufactured separately, and the filter 101 is manufactured by cutting the entire filter glass into a plurality of small filter chips (chips). The bracket 102 is mass-produced by injection molding and other processes. During the camera packaging process, the CIS chip 104 (cmos image sensor) is first mounted on the front of the substrate 103, and then the bottom end of the bracket 102 is bonded to the front of the substrate 103 and the CIS chip 104 is attached. The chip 104 is located in the bracket 102 , then the optical filter 101 is fixed on the bracket 102 by gluing and baking processes, and finally the lens and the motor are bonded to the...

AI Technical Summary

Problems solved by technology

[0003] The optical filter and bracket in the traditional camera are separately customized. In the traditional packaging process, the optical filter 101 and the bracket 102 are attached together by dispensing, which involves many processes, high cost and low production efficiency. The way of glue bonding is likely to cause insufficient connection strength between the optical filter 101 and the bracket 102, and the hidden danger of the optical filter 101 falling off and breaking

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