Wind regulation device for semiconductor manufacturing process environment

Abstract

The invention discloses a wind regulation device for a semiconductor manufacturing process environment. The wind regulation device is arranged at an inlet of the semiconductor manufacturing process environment, and a wind source penetrates through the wind regulation device to enter the semiconductor manufacturing process environment. The wind regulation device comprises a wind shield, a pluralityof regulation modules and a driving module, wherein a plurality of first holes which are uniformly distributed are formed in the wind shield; a plurality of second holes are formed in each regulationmodule; and the driving module is used for arranging the regulation modules on corresponding areas of the wind shield as required so as to regulate the wind pressure and the ventilation quantity on the corresponding areas of the wind shield, and the wind pressure and the ventilation quantity on the corresponding areas are regulated by regulating the overlapping degree of the second holes in the regulation modules and the first holes in the wind shield in the corresponding areas. Through the wind regulation device, wind pressure distribution and the wind volume can be regulated, so that the wind blowing environment is adjustable and controllable, and auxiliary improvement on process control is realized; and the coating film thickness uniformity can be improved.

Description

technical field [0001] The invention relates to semiconductor integrated circuit manufacturing equipment, in particular to an air regulating device for a semiconductor manufacturing process environment. Background technique [0002] With the continuous advancement of technology, product process control and requirements are getting higher and higher. The requirements for wind pressure distribution in the coating process of photoresist and other liquids have been presented in the process considerations. However, at present, the wind in the coating process unit structure is introduced through the windshield, and it cannot be corrected after the hardware is installed. The length varies with each other. At this time, the wind pressure reaching the structure of the coating process unit can only be determined by the installed hardware, and has nothing to do with changes; when the actual wind pressure and ventilation volume cannot meet the requirements of the process, it can only b...

AI Technical Summary

Problems solved by technology

Since the wind pressure and ventilation volume of the wind 201 are fixed after the installation of hardware such as the wind deflector 101 and the pipeline for delivering the wind source to the wind deflector 101 and the power-side machine equipment, it will often make it possible to finally reach the windshield. The wind pressure and air flow on the surface of the wafer 102 are uneven, and finally uniform glue coating cannot be achieved

like figure 2 As shown, because the wind speed in the central region of the wafer 102 is too high, the photoresist 104 in the central region of the wafer 102 will dry too quickly, so that it cannot be shaken evenly, and finally the wafer will be The photoresist 104 in the central area of ​​102 is too thick, and the photoresist that is too thick is also marked with a mark 104a

[0007] The existing windshield 101 is designed to be uniformly manufactured, but differences in the actual installation environment (pipeline length, power supply pressure difference, machine height, and clean room area differences, etc.) will lead to differences between machines and units. has a difference

The final performance is film thickness and uneven coating of liquid medicine

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