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System and method for trimming edge polishing pad

A technology for trimming edges and polishing pads, which is applied in the system field of trimming edge polishing pads, and can solve problems such as wafer edge quality degradation, wafer edge polishing unevenness, and reduced processing efficiency and productivity

Pending Publication Date: 2021-02-19
XIAN ESWIN MATERIAL TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if a new polishing pad is directly used to polish the edge of the wafer, then it will cause uneven polishing of the edge of the wafer during the edge polishing process, thereby causing the phenomenon of deterioration of the quality of the edge of the wafer, and then needs to be polished again, reducing Increased processing efficiency and productivity, increased wafer manufacturing costs

Method used

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  • System and method for trimming edge polishing pad
  • System and method for trimming edge polishing pad
  • System and method for trimming edge polishing pad

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0017] In the round edge polishing process unit in the edge polishing process, because the polishing object is the edge round edge of the wafer rather than the surface plane of the wafer, correspondingly, the structure of the equipment 1 for performing the round edge polishing process unit is as follows figure 1 As shown, it includes: a fixed base plate 11 for placing and fixing the wafer 2 to be polished, a first transmission rod 12 rigidly connected with the fixed base plate, a polishing head 13 and a second transmission rod 14 rigidly connected with the polishing head 13 Wherein, the polishing head 13 comprises: the housing 131 that forms open space and the multiple groups of polishing pad bottom plates 132 arranged in the vertical direction on the inner edge of the housing,...

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Abstract

An embodiment of the invention discloses a system and method for trimming an edge polishing pad. The method can include the steps that an unused new polishing pad is mounted on a polishing pad bottomplate; before a round edge polishing technology unit is executed on a to-be-polished wafer, the new polishing pad makes contact with a trimmer with the same shape and the same size specification as the to-be-polished wafer; and the shape of the surface of the new polishing pad is trimmed through relative movement between the new polishing pad and the trimmer.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductor manufacturing, and in particular to a system and method for trimming an edge polishing pad. Background technique [0002] In the wafer processing process, the edge polishing process may include a groove polishing process unit and a round edge polishing process unit. During the execution of the above two process units, it is necessary to use a corresponding polishing pad and polishing liquid for polishing. [0003] The main component of the polishing pad is polyurethane, and the initial state of the surface felt is usually a state of different lengths. Therefore, if a new polishing pad is directly used to polish the edge of the wafer, then it will cause uneven polishing of the edge of the wafer during the edge polishing process, thereby causing the phenomenon of deterioration of the quality of the edge of the wafer, and then needs to be polished again, reducing The proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/017
CPCB24B53/017
Inventor 徐全
Owner XIAN ESWIN MATERIAL TECH CO LTD
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