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Digital-analog hybrid packaging structure, electronic equipment and packaging process

A packaging structure, digital-analog hybrid technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of inability to miniaturize design, unfavorable layout, large footprint, etc., to speed up information processing and reduce volume. , to achieve the effect of electromagnetic shielding

Active Publication Date: 2021-02-19
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the related art, multiple devices are laid out in a tiled manner, so that the entire design cannot be miniaturized
At the same time, the current sensor system in the industry adopts discrete device design, and the sensor receiving system and signal processing system are mounted on the PCB carrier board. Although the system can be flexibly constructed, the entire processing system occupies a large volume, which is not conducive to being arranged in a small space. in

Method used

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  • Digital-analog hybrid packaging structure, electronic equipment and packaging process
  • Digital-analog hybrid packaging structure, electronic equipment and packaging process
  • Digital-analog hybrid packaging structure, electronic equipment and packaging process

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Embodiment Construction

[0062]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0063] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0064] At the same time, ...

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Abstract

The invention discloses a digital-analog hybrid packaging structure, electronic equipment and a packaging process, the digital-analog hybrid packaging structure comprises a base body, a digital chip assembly, an analog signal processing chip and a sensor assembly, and the base body is provided with a first mounting groove and a second mounting groove which are arranged adjacently; the digital chipassembly is arranged in the first mounting groove and is electrically connected with the base body; the analog signal processing chip is arranged in the second mounting groove and is electrically connected with the base body; and the sensor assembly covers openings of the first mounting groove and the second mounting groove and is electrically connected with the base body. According to the invention, the digital chip, the analog signal processing chip and the analog sensor chip are integrated into a whole, the digital-analog hybrid packaging structure has the advantages of being good in processing chip system air tightness, electromagnetic shielding and the like, and the signal processing speed can be increased.

Description

technical field [0001] The invention relates to the technical field of sensor modules, in particular to a digital-analog hybrid packaging structure, electronic equipment and packaging technology using the digital-analog hybrid packaging structure. Background technique [0002] With the rapid development of industries such as mobile intelligence and the Internet of Things, the demand for high precision and intelligence is getting higher and higher. In order to enable customers to complete system development faster and more conveniently, many sensor manufacturers have begun to provide more advanced modularization. Development is to assemble multiple units together for modular design, so that it has stronger information processing capabilities. However, in the related art, multiple devices are laid out in a tiled manner, so that the whole design cannot be miniaturized. At the same time, the current sensor system in the industry adopts discrete device design, and the sensor rec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/18H01L23/552H01L23/31H01L21/98
CPCH01L25/18H01L23/552H01L23/3107H01L25/50
Inventor 沈霁王伟
Owner GOERTEK MICROELECTRONICS CO LTD
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