Micro-channel radiator combining circular concave cavity and drop-shaped rib column
A water drop type, radiator technology, applied in image communication, microstructure technology, electric solid device and other directions, can solve the problems of calculation method and manufacturing process limitations, etc., to improve reliability and service life, improve heat transfer performance. Effect
Pending Publication Date: 2021-02-26
NANCHANG UNIV
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Problems solved by technology
However, the structure and layout of complex microchannels are limited by calculation methods and manufacturing processes
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[0017] Below in conjunction with accompanying drawing and embodiment the present invention is further described:
[0018] see Figure 1-5 .
[0019] The invention discloses a microchannel radiator combined with a circular concave cavity and a droplet-shaped rib column, which includes a radiator substrate 1, and the radiator substrate 1 includes a solid wall surface 2, a flow channel 3, a droplet-shaped rib column 4 and a circular Shaped concave cavity 5, the flow channel 3 penetrates the inside of the radiator substrate 1, the two sides of the radiator substrate 1 are the working fluid inlet 6 and the working fluid outlet 7 respectively, and the lower part of the radiator substrate 1 is the electronic component Bonding surface 8, in this case, the heat transfer performance of the microchannel heat exchanger can be significantly improved by arranging circular concave cavities and rib columns and other disturbing structures in the microchannel.
[0020] The flow channel 3 is c...
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The invention belongs to the field of micro-channel radiator heat dissipation, and particularly relates to a micro-channel radiator combining a circular concave cavity and a water-drop-shaped rib column, which comprises a radiator substrate, the radiator substrate comprises a solid wall surface, a flow channel, the water-drop-shaped rib column and the circular concave cavity, and the flow channelpenetrates through the interior of the radiator substrate. A working medium inlet and a working medium outlet are formed in the two through sides of the radiator substrate respectively, and the lowerportion of the radiator substrate is an electronic element binding face. Heat of an electronic device is conducted into the radiator through the substrate, then a cooling working medium flows into theheat exchange micro-channel from the heat exchange working medium inlet, flows through the concave cavity and the drop-shaped rib columns, absorbs the heat conducted into the radiator, and finally flows out of the heat exchange micro-channel from the heat exchange working medium outlet, so that the heat of the electronic device is taken away in time. The reliability of the electronic device is improved, and the service life of the electronic device is prolonged.
Description
technical field [0001] The invention belongs to the field of heat dissipation of microchannel radiators, and in particular relates to a microchannel radiator combined with a circular concave cavity and drop-shaped rib columns. Background technique [0002] With the rapid development of microelectronics technology, electronic devices are developing in the direction of miniaturization with high power, high performance and high temperature. The traditional forced-air convection heat transfer method has reached its thermal limit, so it is a challenge to develop an effective method for cooling high-flux devices. The operating limit temperature of electronic devices is generally between 86 and 100 °C. The literature shows that for every 1°C higher than the limit temperature, the reliability of the chip is reduced by 6%, and the life is significantly reduced. Therefore, if the high heat generated by electronic components cannot be eliminated in time, it will pose a huge threat to...
Claims
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IPC IPC(8): B81B7/02H01L23/367H01L23/473
CPCB81B7/02B81B2201/05H01L23/3672H01L23/473
Inventor 张莹胡中全李培生洪坚陈明健俞志国陆培林
Owner NANCHANG UNIV