Automatic wafer unloading production line

Abstract

The invention belongs to the technical field of wafer unloading and provides an automatic wafer unloading production line. The automatic wafer unloading production line comprises a feeding bin, an unloading device and a discharging bin, wherein each of the feeding bin and the discharging bin comprises a bin frame, a carrier basket driven by a first driving device is mounted on each bin frame in asliding manner, and a first carrier shifting mechanism is further arranged on one side of each feeding bin; the wafer discharging device comprises a wafer discharging rack, the wafer discharging rackis provided with a speed chain conveying line, a first carrier positioning mechanism, an automatic screw discharging mechanism, a second carrier positioning mechanism, a taking and placing mechanicalarm, a cover plate placing table, a wafer placing table and a carrier lifting mechanism, and the end of a working shaft of the taking and placing mechanical arm is provided with a taking and placing mechanism; and a second carrier shifting and conveying mechanism is further arranged at the discharging end of the speed chain conveying line. According to the automatic wafer unloading production line, automatic processing of carrier loading, wafer unloading and carrier unloading can be realized, so unloading efficiency is greatly improved, the phenomenon that the wafer is accidentally scratchedin the unloading process is effectively avoided, and the quality and the qualification rate of the wafer are not influenced.

Description

technical field [0001] The invention relates to the technical field of wafer unloading, in particular to an automatic wafer unloading production line. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. During the production and processing of wafers, according to the requirements of the processing technology, the wafers need to be arranged and placed in the wafer tray, and then the entire tray carrying the wafers is placed in a plasma etching machine for ICP etching. After the ICP etching process, the wafers are sequentially taken out from the wafer tray for subsequent AFM tests, etc. The process of taking the wafer out of the wafer tray is called wafer unloading. [0003] At present, the unloading operation of wafers in the tray is usually done manually, and the operator needs to transport the tray after the ICP etching process to the unloading process f...

AI Technical Summary

Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is to provide an automatic wafer unloading production line to solve the current manual unloading method, which is time-consuming and labor-intensive for tray transfer, screw removal, and wafer loading and unloading, and the unloading efficiency is low. , and it is easy to scratch the wafer and affect the technical problems of wafer quality

Images