Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cold trap device and diffusion furnace equipment

A diffusion furnace and cold trap technology, applied in mechanical equipment, lighting and heating equipment, condensation traps/cold partitions, etc., can solve the problems of semiconductor device production capacity impact, long time consumption, etc., to improve maintenance cycle and machine productivity Effect

Pending Publication Date: 2021-03-05
CHANGXIN MEMORY TECH INC
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the maintenance process of the cold trap device in the prior art takes a long time, which will affect the productivity of semiconductor devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cold trap device and diffusion furnace equipment
  • Cold trap device and diffusion furnace equipment
  • Cold trap device and diffusion furnace equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] It can be seen from the background art that the existing cold trap device has the problem that the maintenance process takes a long time.

[0035] In order to solve the above problems, an embodiment of the present invention provides a cold trap device. An inner shell is also provided in the outer shell. The inner shell and the outer shell have an air inlet and an air outlet respectively, and are used to provide a cooling pipe for a low-temperature environment. The passage is located within the inner housing, allowing the by-products to condense on the inner housing walls. When the rate of capturing reaction by-products in the inner shell is lower than the preset level, the entire inner shell and the cooling pipeline located in the inner shell can be directly taken out and replaced with a new inner shell and cooling pipeline, thereby shortening the cooling time. The maintenance of the well device is time-consuming, and the productivity of the machine is improved.

[003...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention relates to a cold trap device and diffusion furnace equipment. The cold trap device comprises an outer shell, an inner shell and a cooling pipeline; the outer shell comprises a first air inlet and a first air outlet; the inner shell is located in the outer shell; the inner shell is detachable relative to the outer shell; the inner shell comprises a second air inletand a second air outlet; the second air inlet is communicated with the first air inlet; the second air outlet is communicated with the first air outlet; and the cooling pipeline is positioned in the inner shell. The maintenance time of the cold trap device can be shortened, and the productivity of a machine table is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a cold trap device and diffusion furnace equipment. Background technique [0002] With the advancement of semiconductor manufacturing technology and the increasing demand for electronic devices, the production capacity of semiconductor devices has become the focus of major manufacturers, and the production capacity of semiconductor devices is related to the operating efficiency of process equipment on production line machines, including diffusion furnace equipment. The cold trap device is an important part of the diffusion furnace equipment, and its running time determines the production capacity of semiconductor devices to a certain extent. [0003] At present, the cold trap device mostly uses the low-temperature characteristics of the metal shell of the device to capture the reaction by-products, and the reaction by-product vapor is deposited on the inner wall of the me...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B01D8/00
CPCB01D8/00
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products