Laminated electronic component
An electronic component, stack-type technology, applied in fixed capacitor parts, electrical components, multilayer capacitors, etc., can solve the problem of the decrease of the bonding force between the dielectric layer and the internal electrode layer, and achieve the effect of improving the bonding force
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 2 Embodiment approach -
[0078] Regarding the multilayer ceramic capacitor 100A showing the second embodiment of the multilayer electronic component according to the present disclosure, using Figure 5 Be explained. The multilayer ceramic capacitor 100A includes a multilayer body 10A. The other constituent elements are the same as those of multilayer ceramic capacitor 100 , and therefore description thereof will be omitted. In addition, since the macroscopic structure of the multilayer ceramic capacitor 100A is the same as that of the multilayer ceramic capacitor 100, the illustration is omitted (see figure 1 ).
[0079] Figure 5 It is a schematic diagram of a TEM observation image of the dielectric layer 11A included in the multilayer ceramic capacitor 100A. Multilayer body 10A in multilayer ceramic capacitor 100A includes a plurality of stacked dielectric layers 11A and a plurality of internal electrode layers 12 . The dielectric layer 11A contains a CZ-based perovskite phase and also contains...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


