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Laminated electronic component

An electronic component, stack-type technology, applied in fixed capacitor parts, electrical components, multilayer capacitors, etc., can solve the problem of the decrease of the bonding force between the dielectric layer and the internal electrode layer, and achieve the effect of improving the bonding force

Active Publication Date: 2021-03-05
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the dielectric material becomes chemically stable, and on the other hand, there is a concern of causing a decrease in the bonding force between the dielectric layer and the internal electrode layer

Method used

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no. 2 Embodiment approach -

[0078] Regarding the multilayer ceramic capacitor 100A showing the second embodiment of the multilayer electronic component according to the present disclosure, using Figure 5 Be explained. The multilayer ceramic capacitor 100A includes a multilayer body 10A. The other constituent elements are the same as those of multilayer ceramic capacitor 100 , and therefore description thereof will be omitted. In addition, since the macroscopic structure of the multilayer ceramic capacitor 100A is the same as that of the multilayer ceramic capacitor 100, the illustration is omitted (see figure 1 ).

[0079] Figure 5 It is a schematic diagram of a TEM observation image of the dielectric layer 11A included in the multilayer ceramic capacitor 100A. Multilayer body 10A in multilayer ceramic capacitor 100A includes a plurality of stacked dielectric layers 11A and a plurality of internal electrode layers 12 . The dielectric layer 11A contains a CZ-based perovskite phase and also contains...

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Abstract

Provided is a laminated electronic component capable of improving the bonding force between a dielectric layer using a CZ-based dielectric material and an internal electrode layer. The laminated electronic component includes a stacked body having therein a plurality of dielectric layers including a CZ-based perovskite phase and an element M1, a plurality of internal electrode layers including Cu,and an interface layer including the element M1 in at least a portion of an interface with the plurality of internal electrode layers. The element M1 is an element that has a binding energy between CZand Cu via the element M1 of less than or equal to -9.8 eV by first-principles calculation using a pseudo-potential method. When amounts of elements included in the dielectric layers are expressed asparts by mol, a ratio m1 of an amount of the element M1 to an amount of the Zr in the interface layer is 0.03<=m1<=0.25.

Description

technical field [0001] The present disclosure relates to laminated electronic components. Background technique [0002] An example of a multilayer electronic component includes a multilayer ceramic capacitor. In multilayer ceramic capacitors for temperature compensation, sometimes CaZrO 3 A dielectric material of the CZ system (hereinafter, sometimes abbreviated as a CZ system) is used for the dielectric layer. Here, the so-called CZ system includes not only CaZrO 3 , also includes CaZrO in which a part of Ca, a part of Zr, or a part of Ca and Zr are replaced by appropriate elements 3 Solid solution material system. [0003] For example, JP 2001-351828 A discloses a multilayer ceramic capacitor including a dielectric layer using a CZ-based dielectric material. The CZ-based dielectric material described in Japanese Patent Application Laid-Open No. 2001-351828 contains a CZ-based perovskite compound as a main component and Al, Si, Mn, etc. as subcomponents. [0004] The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/30C04B35/48
CPCH01G4/1245H01G4/30C04B35/48C04B2235/3208H01G4/012H01G4/1236B32B18/00C04B2237/348C04B37/025C04B2237/407C04B35/486C04B2235/768C04B2235/80C04B2237/704C04B2235/785C04B35/62685C04B2235/3217C04B2235/3418C04B2235/3262C04B2235/3232C04B2235/3239C04B2237/06C04B2237/062C04B2237/064C04B2237/068H01G4/0085H01G4/008C04B35/057C04B2235/3206
Inventor 和泉达也平田朋孝
Owner MURATA MFG CO LTD