An intelligent assembly line for LED packaging
An assembly line and LED packaging technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of low production efficiency and high labor costs, and achieve the effects of reducing labor costs, quality assurance, and reducing repair rates.
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[0024] As an embodiment of the present invention, a third manipulator 10 is provided on the workbench 1 between the second manipulator 8 and the mounting frame 12, and the third manipulator 10 is provided with a plasma that matches the position of the placement tank 4. Cleaning device 11. Through the arrangement of the plasma cleaning device 11, the positive and negative ions generated by the plasma cleaning machine in a vacuum state can remove oxides on the surface of the workpiece, and the effect of subsequent welding and glue filling can be improved.
[0025] As an embodiment of the present invention, the glue pouring device 15 includes a hollow glue barrel, the lower end of the glue barrel is provided with a nozzle 22 with a spray hole 24, and the inner cavity of the glue barrel is connected to the spray hole 24 through a communication channel 23. Connected, the spray head 22 is located directly above the placement tank 4; the lower side wall of the glue bucket is provided...
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