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Double-color COB packaging method

A packaging method and LED chip technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of poor control of the amount of two types of fluorescent glue, inconsistent light and color of products, etc., to achieve the effect of ensuring consistency

Active Publication Date: 2021-03-12
HONGLI ZHIHUI GRP CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

In this way, it is difficult to control the amount of two kinds of fluorescent glue, especially the formation of the first glue layer, so it often leads to inconsistent light and color of the product.

Method used

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  • Double-color COB packaging method

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the accompanying drawings of the description.

[0020] Such as figure 1 As shown, a packaging method of a two-color COB includes the following steps:

[0021] (1) Die-bonding on the die-bonding area of ​​the substrate 3, the LED chip on the substrate 3 is divided into a first LED chip 1 and a second LED chip 2, and the first LED chip 1 and the second LED chip 2 are inverted The blue light chip installed, the LED chips are arranged in an array, the first LED chip 1 and the second LED chip 2 in the same row are arranged at intervals, and the first LED chip 1 and the second LED chip 2 in the adjacent row are arranged in a misplaced position. The setting can make the overall light output more uniform;

[0022] (2) Make a cofferdam 4 on the substrate 3 to surround the LED chip, and the height of the cofferdam 4 is higher than the height of the top surface of the LED chip;

[0023] (3) Dot glue on th...

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Abstract

A double-color COB packaging method comprises the following steps: (1) carrying out die bonding on a substrate, and dividing LED chips on the substrate into a first LED chip and a second LED chip; (2)manufacturing a cofferdam on the substrate to enclose the LED chip; (3) fixing a water-soluble sheet on the top light-emitting surface of the second LED chip; (4) filing the cofferdam range with a first fluorescent colloid, so that the first fluorescent colloid completely covers the first LED chip, and the top surface of the first fluorescent colloid is flush with the top surface of the water-soluble sheet; (5) washing the water-soluble sheet with water, and forming a groove at the top of the second LED chip after the water-soluble sheet is dissolved; and (6) filling the groove with a secondfluorescent colloid, wherein the top surface of the second fluorescent colloid is flush with the top surface of the first fluorescent colloid. The packaging process is simple, and the product consistency is good.

Description

technical field [0001] The invention relates to LED packaging technology, in particular to a double-color COB packaging method. Background technique [0002] The traditional two-color temperature COB light source currently adopts the following manufacturing methods: CSP chip + CSP chip; CSP chip + conventional chip and then dot powder; dot fluorescent glue with different color temperatures on different LED chips. The chip CSP solution is a wafer-level package, which can directly package different colors and color temperatures on the chip, but this kind of chip package is not only expensive, but also not flexible enough to adjust the color temperature and display, and cannot meet the requirements of different customers. need. It is a common practice to point fluorescent glues with different color temperatures on different LED chips. For example, the Chinese Patent Publication No. CN110047824A discloses a two-color temperature COB light source and its preparation method. The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L25/075
CPCH01L33/505H01L25/0753H01L2933/0041
Inventor 梁依雯赵明深王芝烨
Owner HONGLI ZHIHUI GRP CO LTD
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