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Display panel, electronic equipment and manufacturing method of display panel

A technology for a display panel and a manufacturing method, which is applied in the manufacture of electronic equipment and display panels, and in the field of display panels, which can solve problems such as packaging failure, packaging layer thickness, and complexity, and achieve the effects of enhanced packaging effect, reduced thickness, and simple packaging process

Pending Publication Date: 2021-03-16
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inventors found that the packaging process of the current display panel is relatively complicated, and the deposited film is not highly bonded to the substrate, and cracks are prone to occur when it is bent, resulting in packaging failure. In addition, the packaging layer is thick and is not conducive to the narrow frame design of the display panel.

Method used

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  • Display panel, electronic equipment and manufacturing method of display panel
  • Display panel, electronic equipment and manufacturing method of display panel
  • Display panel, electronic equipment and manufacturing method of display panel

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Experimental program
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Embodiment Construction

[0029] As mentioned in the background technology, the existing flexible display panel adopts the way of film encapsulation, such as figure 1 As shown, the display panel includes a substrate 11 , a display module 12 , a thin film encapsulation layer 13 and a protective film 14 . Specifically, the display module 12 is arranged on one side of the substrate 11, and may include an array layer, a light emitting layer, etc. The specific structure of the display module is described in detail.

[0030] Afterwards, a thin film encapsulation layer 13 is provided on the surface of the display module 12 away from the substrate 11. Usually, the thin film encapsulation layer is a structure in which an organic film is superimposed on an inorganic film. figure 1 Among them, the thin film encapsulation layer has a three-layer structure of inorganic film 131+organic film 132+inorganic film 133. Specifically, the lower SiNx / SiOx inorganic film (inorganic film 131) is deposited on the surface of ...

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Abstract

The invention provides a display panel, electronic equipment and a manufacturing method of a display panel. The display panel comprises a flexible substrate and a display module, the flexible substrate comprises a first sub-flexible substrate and a second sub-flexible substrate, the second sub-flexible substrate comprises a first wrapping part, the first wrapping part at least wraps the edge partof the first sub-flexible substrate after being bent to form a sealed cavity, and a display module is arranged in the sealed cavity. According to the scheme, the display module is packaged through theflexible substrate, the packaging process is simple, and the packaging effect is enhanced. In addition, the thickness of the flexible substrate is smaller than that of an existing thin film packaginglayer, so that the thickness of the display panel provided by the invention is reduced.

Description

technical field [0001] The present invention relates to the field of display technology, and more specifically, to a display panel, electronic equipment and a method for manufacturing the display panel. Background technique [0002] At present, the conventional packaging method of flexible display panels is thin-film packaging. Specifically, thin-film packaging is to coat an organic film on the basis of an inorganic film, and then deposit an inorganic film on the basis of the organic film, so that The stacked thin-film encapsulation layer isolates external pollution. In addition, in order to further prevent the thin film encapsulation layer from being scratched and block water vapor, a protective film is attached to the surface of the thin film encapsulation layer. The inventors found that the packaging process of the current display panel is relatively complicated, and the bonding force between the deposited film and the substrate is not high, and cracks are prone to occur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/12H01L21/56G09F9/30
CPCH01L23/3121H01L23/12H01L21/56G09F9/301
Inventor 刘佳王垚林熊志勇
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD