Interconnect structures

Abstract

Interconnect structures are disclosed herein. An exemplary interconnect structure includes a first contact feature in a first dielectric layer, a second dielectric layer over the first dielectric layer, a third dielectric layer over the second dielectric layer, a second contact feature extending through the second dielectric layer and the third dielectric layer, and a graphene layer between the second contact feature and the third dielectric layer.

Description

technical field [0001] Embodiments of the present invention relate to an interconnection structure, in particular to an interconnection structure with a graphene barrier layer. Background technique [0002] The integrated circuit (IC) industry has experienced exponential growth. Technological advances in IC materials and design have produced several generations of ICs, each generation having smaller and more complex circuits than the previous generation. In the course of IC evolution, functional density (ie, the number of interconnected devices per chip area) generally increases, while geometry size (ie, the smallest element (or line) that can be produced using a process) decreases. This scaling down process generally provides benefits by increasing production efficiency and reducing associated costs. [0003] This miniaturization has also increased the complexity of ICs processing and manufacturing, and in order to realize these advances, similar developments in IC proces...

AI Technical Summary

Problems solved by technology

It has been observed that the high contact resistance exhibited by interconnects in advanced IC technology nodes can significantly delay (and in some cases prevent) signals from efficiently traveling to and from IC devices such as transistors, failing to improve advanced IC technology. Transistor performance of this IC device in technology node

Thus, while existing interconnect contacts are generally adequate for their intended purpose, they are not entirely satisfactory in all respects

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