Substrate chuck for self-assembling semiconductor light-emitting diodes
A technology of light-emitting diodes and substrate cards, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of insufficient research on manufacturing display technology, achieve easy loading or unloading, low cost, prevent The effect of destruction
Pending Publication Date: 2021-03-19
LG ELECTRONICS INC
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- Application Information
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[0005]
Recently, U.S. Patent No. 9,825,202 discloses a microLED structure suitable for self-assembly, but insufficient research has been done on the technology of manufacturing displays through self-assembly of microLEDs
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[0054] Description will now be given in detail according to the exemplary embodiments disclosed herein with reference to the accompanying drawings. For the sake of brief description with reference to the drawings, the same or equivalent components may be provided with the same or similar reference numerals, and description thereof will not be repeated. Generally, suffixes such as "module" and "unit" may be used to refer to elements or components. The use of such suffixes herein is only intended to facilitate the description of the specification, and the suffixes themselves are not intended to give any special meaning or function. In the present disclosure, for the sake of brevity, the contents that are known to those of ordinary skill in the related art are generally omitted. The accompanying drawings help to easily understand various technical features, and it should be understood that the embodiments presented herein are not limited by the accompanying drawings.
[0055] I...
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The present disclosure provides a substrate chuck for placing semiconductor light emitting diodes dispersed in a fluid at predetermined positions of a substrate. The substrate chuck may include: a substrate support part for supporting a substrate having an assembly electrode; a vertical moving part which lowers the substrate so that one surface of the substrate comes in contact with a fluid in a state in which the substrate is supported; an electrode connection part for applying power to the assembly electrode to generate an electric field so that semiconductor light-emitting diodes are placedat the predetermined positions of the substrate in a process of moving the semiconductor light-emitting diodes by a position change of a magnet; and a rotating part for rotating the substrate supportpart around a rotating shaft so that the substrate is placed in an upward or downward direction, wherein the rotating shaft is spaced apart from a center of the substrate support part at a predetermined distance.
Description
technical field [0001] The present disclosure relates to a method for manufacturing a display device, and more particularly, to a substrate chuck for self-assembling microLEDs. Background technique [0002] In recent years, in the field of display technology, liquid crystal displays (LCDs), organic light emitting diode (OLED) displays, microLED displays, and the like have entered the fray to realize large-area displays. [0003] Meanwhile, semiconductor light-emitting diodes (microLEDs (μLEDs)) with diameters or cross-sectional areas less than 100 micrometers can offer very high efficiency when used in displays, since displays do not require polarizers to absorb light. However, large displays require millions of semiconductor light-emitting diodes, which makes device transfer difficult compared to other technologies. [0004] Some of the technologies currently being developed for the transfer process include pick and place, laser lift-off (LLO), and self-assembly. Among th...
Claims
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IPC IPC(8): H01L21/683H01L27/15
CPCH01L21/6835H01L27/156H01L2221/68368H01L25/0753H01L33/0095H01L24/95H01L24/75H01L2224/7598H01L2224/95085H01L2224/95136H01L2224/95144H01L2224/75735H01L2224/75824H01L2224/75822H01L2224/95145H01L2224/95133H01L2224/95148H01L2224/95146H01L2224/75705H01L2224/7565H01L2224/756H01L2224/75823H01L2224/95H01L2924/3511H01L2224/95101H01L2224/81H01L21/67709H01L21/68H01L2933/005
Inventor 杨仁范鲁正勋郑任悳崔凤云
Owner LG ELECTRONICS INC